Chip Package Cover Bonding with Reflected UV Curing
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Solution Overview
Problem
Conventional chip package production methods using photo-curable glue face inefficiencies due to the need for ultraviolet light solidification, which is hindered by the addition of black light-absorbing layers to prevent flare issues.
Innovation Solution
Incorporating a reflecting member on the substrate to redirect a solidifying light beam onto the glass adhesive, allowing for the solidification of the support body without blocking the light.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a black light-absorbing layer is added on the glass cover to block light beams and prevent flare issues, then the flare issue is prevented, but the photo-curable glue cannot be solidified by the ultraviolet light beam
Solution Approach 1:
A reflecting member (intermediary element) is introduced between the ultraviolet light source and the photo-curable glue. This reflecting member redirects the light beam to reach the glue for solidification, while the black light-absorbing layer continues to block excessive light on the glass cover. The intermediary enables both the prevention of flare and the solidification of adhesive to occur simultaneously.
2Reliability
If a photo-curable glue is used to surround the sensing chip as a supporting fence structure, then the chip is supported and sealed, but the production efficiency is reduced due to the need for ultraviolet light solidification process
Solution Approach 1:
The reflecting member is pre-positioned on the substrate before the photo-curable glue is applied. This preliminary arrangement ensures that when ultraviolet light is subsequently applied, the light is already optimally directed onto the glue, enabling rapid and reliable solidification. The preliminary positioning of the reflecting member streamlines the overall production process.
3Strength
If the photo-curable glue is applied to adhere the glass cover to the substrate, then the glass cover is securely mounted, but the light beam is blocked preventing proper solidification
Solution Approach 1:
Instead of attempting to increase light intensity in the direct vertical path (which is blocked by the glass cover), the reflecting member redirects light from a different angular dimension. The light beam approaches the photo-curable glue from a redirected path, bypassing the blocking effect of the glass cover while still providing sufficient illumination for solidification.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency by ensuring proper solidification of the glass adhesive, thereby improving the chip package structure's integrity and reducing delamination risks.
Implementation Method 1
performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member is utilized to reflect the solidifying light beam to the glass adhesive to solidify the glass adhesive
Implementation Method 2
a special photo-curable glue (e.g., an ultraviolet glue) may be used, and the photo-curable glue needs to be solidified by an ultraviolet light beam
Data Source
AI summary
A chip package structure and a method for producing the same are provided. The method at least includes: providing a substrate; placing a chip upside-down on the substrate; forming bonding wires coupled with the chip and the substrate; providing at least one reflecting member on an upper surface of the substrate, forming a support body on the substrate to cover the at least one reflecting member; providing a package cover adhered to the support body by a glass adhesive; performing a solidifying process in which a solidifying light beam is emitted to the reflecting member and the reflecting member reflects the solidifying light beam to the glass adhesive to solidify the glass adhesive; performing a packaging process in which a package body is formed to cover an edge surface of the package cover and a top part of the support body.