Wafer-Level Chip Packaging Structure with Connecting Layer
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Solution Overview
Problem
Conventional chip packaging processes are time-consuming and costly, particularly in the optoelectronic industry where miniaturization and multi-functionality of semiconductor devices require more efficient packaging solutions.
Innovation Solution
A chip packaging structure comprising a chip surrounded by conductive pillars, encapsulated with a connecting layer and trace layer, and optionally solder balls, which allows for efficient electrical connections and reduced manufacturing time and cost through a wafer-level package process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional chip packaging processes are used, then manufacturing precision and reliability are maintained, but manufacturing time is excessive and production cost is high
Solution Approach 1:
The patent merges multiple packaging operations into a single wafer-level processing step. Multiple chips on a wafer are packaged simultaneously through one encapsulation process, rather than packaging each chip individually. This consolidation of operations dramatically reduces the total packaging time while maintaining quality standards.
Solution Approach 2:
The patent performs preliminary positioning and alignment of multiple chips on the wafer before the actual encapsulation process. Conductors and encapsulant are prepared in advance and positioned correctly, so that when encapsulation occurs, everything is already in place for immediate sealing. This preliminary preparation eliminates time-consuming adjustments during the packaging process itself.
2Productivity
If wafer-level package process is used, then manufacturing time and cost are reduced, but electrical connection reliability between chip and conductors must be ensured
Solution Approach 1:
The patent applies different material properties to different regions of the packaging structure. The encapsulant material is specifically selected to provide both mechanical protection and appropriate electrical insulation, while conductor regions are designed with optimal conductivity. This localized optimization of material properties ensures reliable electrical connections are formed at the chip-conductor interfaces while maintaining mass production efficiency.
Solution Approach 2:
The patent employs composite material structures in the encapsulation process, combining materials with complementary properties. The encapsulant may incorporate conductive fillers or layered structures that simultaneously provide electrical insulation in most areas while ensuring reliable electrical connection at specific contact points. This composite approach maintains connection reliability while enabling wafer-level processing.
3Adaptability or versatility
If optoelectronic devices are miniaturized for multi-functionality, then device functionality is enhanced, but packaging complexity increases
Solution Approach 1:
The patent designs a universal wafer-level packaging process that can accommodate multiple different optoelectronic device types and configurations on the same wafer. The same encapsulation methodology and material system are applied regardless of the specific device functionality, whether optical, electrical, or sensing applications. This universal approach handles device complexity through process standardization rather than increasing packaging complexity.
Solution Approach 2:
The patent segments the wafer into multiple independent chip regions, each potentially containing different device functionalities. The encapsulation process treats each chip region as a separate unit while processing the entire wafer simultaneously. This segmentation allows diverse multi-functional devices to be packaged together without requiring complex integrated packaging structures, as each segment is handled by the same standardized process.
Data Source
AI summary
A chip packaging structure comprising a chip, a plurality of conductive pillars surrounding the chip, an encapsulation encapsulating the chip and the conductive pillars, and a connecting layer is provided. The encapsulation has a first side and a second side corresponding to the first side. The connecting layer is disposed at the first side of the encapsulation and electrically connected between the chip and the conductive pillars. Furthermore, a chip packaging process accompanying the chip packaging structure is also provided. The chip packaging structure is more useful and powerful and is suitable for various chip packaging applications, and the chip packaging process can reduce the manufacturing time and save the production cost.