Chip Packaging Structure Impact Resistance via Die Attach Film Thickness
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Solution Overview
Problem
Existing fingerprint sensors fail to meet high-strength requirements under external static pressure and impact, often resulting in functional failure and chip cracking.
Innovation Solution
A chip packaging structure that increases the thickness of the die attach film to improve impact resistance, without altering the carrier structure, and includes a protection layer and surface smoothing to enhance durability, facilitating mass production and cost savings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the die attach film is increased to improve impact resistance, then the strength of the chip is improved, but the total thickness of the packaging structure increases
Solution Approach 1:
The patent changes the thickness parameter of the die attach film from conventional thin specifications to a specific range of 40-150 micrometers. This parameter change provides sufficient cushioning thickness to absorb impact energy while protecting the chip, yet remains controlled enough to maintain acceptable overall packaging dimensions for mass production applications.
2Strength
If the carrier structure is modified to improve chip strength, then the impact resistance is enhanced, but the manufacturing complexity and mold cost increase
Solution Approach 1:
Instead of modifying the entire carrier structure globally, the patent applies a localized solution by increasing only the die attach film thickness in the specific region where impact protection is needed. This localized approach enhances chip protection without requiring complex carrier redesign, maintaining simplicity for mass production while addressing the specific vulnerability of the chip area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the overall impact resistance and strength of the chip, reduces production difficulties, and maintains a constant total thickness, thereby improving packaging yield and device performance.
Implementation Method 1
the die attach film 3 can be a soft material, which can have a good buffering effect on the die 1 once the external object impacts the die 1
Data Source
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AI summary
Embodiments of the present disclosure relate to packaging technologies, and disclose a chip packaging structure and packaging method. The chip packaging structure comprises a die, a carrier, a die attach film and a plastic package body; the die attach film is disposed on the bottom surface of the die, with a thickness thereof being greater than or equal to 40 micrometers; the die is disposed on the carrier via the die attach film; and the plastic package body is disposed on the carrier and coats a top surface and side surfaces of the die. Embodiments of the present disclosure further provide a chip packaging method. Compared with the existing technologies, the embodiments can improve the overall impact resistance of a chip without changing the structure of the carrier, save the expense for making a mold; and moreover, the packaging structure is simple and easy for mass production.