Chip Packaging Structure With Sidewall Glass Access
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Solution Overview
Problem
Current image sensor packaging structures require the entire device to be replaced when the light-transmitting glass is damaged, leading to increased maintenance costs due to the inability to independently replace the glass.
Innovation Solution
A chip packaging structure and method where a light-transmitting glass is embedded in a substrate with openings on the sidewalls, allowing it to be easily detached and replaced, using clamping grooves and thermoplastic sealing glue for secure mounting and easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the light-transmitting glass is fixed on the substrate using glue in conventional packaging structures, then the glass is securely mounted and protected, but when the glass is damaged the entire image sensor must be replaced, increasing maintenance costs
Solution Approach 1:
The substrate structure is segmented into multiple functional regions: a light-transmitting hole, clamping grooves on sidewalls, and openings. This segmentation allows the light-transmitting glass to be independently accessed and replaced through the openings without affecting other components, resolving the contradiction between secure mounting and ease of repair.
Solution Approach 2:
The clamping grooves act as an intermediary mechanism between the substrate and the light-transmitting glass. These grooves provide a mechanical interface that secures the glass during operation while allowing it to be removed and replaced through the openings, thus enabling both reliable mounting and easy replacement.
2Ease of repair
If the light-transmitting glass is embedded in the substrate with clamping grooves and openings, then the glass can be easily replaced independently, but the mounting structure becomes more complex
Solution Approach 1:
The mounting structure merges multiple functions into the substrate itself: the substrate provides both the light-transmitting hole and the clamping grooves with openings. This integration avoids adding separate complex mounting components, thus enabling easy replacement without significantly increasing device complexity.
3Reliability
If glue is used to fix the light-transmitting glass on the substrate, then the glass is securely mounted, but glue may enter the photosensitive area of the chip, reducing product yield
Solution Approach 1:
The mounting function is extracted from the top surface of the substrate and relocated to the sidewalls through clamping grooves. This extraction prevents glue from being dispensed on the photosensitive area, as the sealing now occurs at the lateral interfaces between the glass and substrate sidewalls, eliminating the harmful effect of glue contamination.
Solution Approach 2:
The sealing interface is moved from the vertical dimension (top surface of substrate) to the horizontal dimension (sidewalls of substrate). By forming clamping grooves on the sidewalls and sealing in these lateral interfaces, the patent prevents glue from contacting the photosensitive area while maintaining secure mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates convenient replacement of the light-transmitting glass, reducing maintenance costs and extending its service life by allowing independent replacement, while protecting the glass from surface damage and improving product yield by preventing glue from entering the photosensitive area.
Implementation Method 1
the clamping grooves are filled with thermoplastic sealing glue
Data Source
AI summary
The present disclosure provides a chip packaging structure and a chip packaging method, relating to the technical field of chip packaging. In the above, the chip packaging structure includes: a substrate, wherein a light-transmitting hole penetrating through upper and lower surfaces thereof is provided on the substrate, and openings communicated with the light-transmitting hole are formed on two opposite sidewall surfaces of the substrate, respectively; light-transmitting glass, wherein two opposite sides of the light-transmitting glass are inserted into the two openings, respectively, and shield the light-transmitting hole; a chip, provided on the upper surface of the substrate, wherein a photosensitive area of the chip faces the light-transmitting glass; and a packaging layer, provided on the chip and the upper surface of the substrate so as to package the chip on the substrate.