Chip Packaging with Open-Slot Baseplate for Complete Filling
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Solution Overview
Problem
Current chip packaging methods, such as injection molding and film-on-wire processes, face issues with incomplete filling due to the small area between the top chip and support portion, leading to poor reliability and hindering the miniaturization and thinning of electronic products.
Innovation Solution
A method involving a baseplate with an open slot, where a release base material is bonded to one side, a chip is mounted on the release base material, and then packaged on the baseplate, with the release material removed to form a package structure, improving reliability and reducing chip thickness by allowing for efficient stacking and packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If injection molding or film-on-wire process is used for packaging, then the packaging structure can be formed, but incomplete filling occurs due to small area between top chip and support portion, resulting in poor reliability
Solution Approach 1:
The baseplate is segmented with an open slot that divides the packaging space, allowing the packaging material to be injected or applied separately into the slot area. This segmentation ensures complete filling of the previously difficult-to-reach small area between the top chip and support portion, thereby improving manufacturing precision and packaging reliability
Solution Approach 2:
The open slot is pre-formed in the baseplate before chip mounting and packaging. This preliminary structural preparation creates a defined pathway and space for the packaging material, ensuring that the material can completely fill the required areas without deficiency, thus resolving the filling completeness issue before the actual packaging process
2Quantity of substance
If chip-stacked packaging is used to increase storage capacity, then storage capacity increases, but package thickness increases, hindering miniaturization and thinning
Solution Approach 1:
Instead of stacking chips vertically in the thickness direction (z-axis), the open slot structure enables chips to be arranged horizontally within the plane of the baseplate (x-y plane). This dimensional change allows multiple chips to be packaged side-by-side or in a spread-out configuration, increasing storage capacity while maintaining reduced package thickness, thus supporting miniaturization requirements
Data Source
AI summary
Disclosed is a method for packaging a chip, comprising the following steps: providing a baseplate formed with an open slot thereon penetrating through opposite sides of the baseplate; providing a release base material, wherein the release base material is bonded to a first side of the baseplate and covers the open slot; providing a chip, wherein the chip is mounted on the release base material at the position of the open slot; packaging a second side of the baseplate facing away from the release base material so as to form a packaging layer which packages the chip and fixes it on the baseplate; removing the release base material so as to obtain a package structure for the chip.