Chip Packaging Overflow Proof Device with Retaining Wall

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Solution Overview

Problem

Conventional semiconductor packaging processes face issues with colloid squeeze-out due to excessive filling or high viscosity, leading to compromised appearance and increased costs for removal, as well as potential impact on binding strength between the colloid and packaging base.

Innovation Solution

A packaging base with an overflow space is designed to accommodate squeeze-out, featuring a retaining wall and a second cable-terminating hole positioned lower than the first, allowing any excess colloid to enter the overflow space without escaping the packaging base, thus preventing damage and maintaining appearance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If packaging colloid is filled excessively or with high viscosity, then the chip is well protected, but colloid squeeze-out occurs compromising appearance and binding strength

Engineering Contradiction:

Improvechip protectionVSAvoidcolloid squeeze-out

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The packaging base is segmented into functional zones: a normal filling space for chip protection and an overflow space for containing excess colloid. The retaining wall creates this segmentation, directing squeeze-out into the overflow space rather than allowing it to compromise the appearance or binding strength of the main packaging structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The harmful effect of colloid squeeze-out is converted into a beneficial feature by designing the overflow space to intentionally receive and contain the excess colloid. What was previously a defect (squeeze-out) becomes a controlled feature that maintains both chip protection and appearance quality.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If colloid squeeze-out occurs, then chip protection is maintained, but appearance is compromised and extra removal cost is incurred

Engineering Contradiction:

Improvechip protectionVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The overflow space converts the harmful squeeze-out into a beneficial containment feature. Excess colloid is directed into the overflow space during filling, eliminating the need for post-filling removal processes and associated costs while maintaining chip protection.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The overflow space is pre-designed and positioned during the packaging base manufacturing stage. This preliminary action prevents squeeze-out issues before they occur during the colloid filling process, eliminating the need for costly post-processing removal operations.

Inventive Principle:

Principle #10Preliminary action

3Reliability

If colloid squeeze-out occurs, then chip protection is maintained, but binding strength between colloid and packaging base is affected

Engineering Contradiction:

Improvechip protectionVSAvoidbinding strength

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The packaging base is divided into a binding area (normal filling space) and an overflow area separated by the retaining wall. This segmentation ensures that excess colloid is contained in the overflow space away from critical bonding regions, preserving the binding strength between the colloid and packaging base while maintaining chip protection.

Inventive Principle:

Principle #1Segmentation

4Object-affected harmful factors

If retaining wall is added to create overflow space, then colloid squeeze-out is prevented, but device complexity increases

Engineering Contradiction:

Improvecolloid squeeze-outVSAvoidpackaging base structure

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The retaining wall is a localized structural feature added only in specific areas of the packaging base where overflow control is needed. This local modification rather than a complete structural redesign minimizes the increase in device complexity while effectively preventing colloid squeeze-out.

Inventive Principle:

Principle #3Local quality

Data Source

PatentUS7683466B2Chip packaging overflow proof device

Publication Date: 2010.03.23 TAIWAN OASIS TECH CO LTD

AI summary

A chip packaging overflow proof device includes a chip disposed on a substrate; a circuit connected to the chip being provided to each of both sides of the substrate; both of the substrate and the chip being placed in a packaging base; a socket being each provided on both sides of the packaging base to receive insertion by a lid; a first cable-terminating hole being provided between the socket and the lid to permit the circuit to penetrate through; one or a plurality of retaining wall being disposed on the packaging base at where closer to the socket; a second cable-terminating hole being provided on the retaining hole; an overflow space being defined between the retaining wall and the socket; the overflow space being disposed at a level lower than that of the second cable-terminating hole; and the overflow space accepts any squeeze-out from a chip packaging colloid.