Chip Packaging Structure With Protective Layer Against Encapsulation Leakage
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Solution Overview
Problem
During chip packaging, the encapsulation material easily permeates into the gap between the chip and the carrier, potentially damaging the bonding pads and circuit, leading to increased defect rates.
Innovation Solution
A protective layer is formed on the front surface of the chip, which is then mounted on a carrier with the back surface facing outwards, preventing encapsulation material from penetrating between the chip and the carrier, and the carrier is detached after encapsulation to expose the protective layer, thereby protecting the chip's surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip is mounted on the carrier with the front surface facing outwards for encapsulation, then the encapsulation process can be completed, but the encapsulation material permeates into the gap between the chip and carrier, damaging the bonding pads and circuit
Solution Approach 1:
The patent inverts the conventional mounting orientation by mounting the chip on the carrier with the back surface facing outwards and the front surface (with bonding pads) facing towards the carrier. This inversion prevents encapsulation material from penetrating and damaging the bonding pads, as the protective layer on the front surface is now shielded by the carrier itself.
Solution Approach 2:
The patent introduces a protective layer as an intermediary between the chip's front surface and the carrier. This protective layer (formed by depositing or laminating material on the front surface) acts as a barrier that prevents encapsulation material from penetrating into gaps and damaging the bonding pads and circuit, while still allowing the chip to be properly mounted and encapsulated.
2Object-affected harmful factors
If the chip is mounted on the carrier with the back surface facing outwards, then the front surface is protected from encapsulation material penetration, but the bonding pads are covered and require additional steps to expose for rewiring
Solution Approach 1:
The patent performs preliminary actions by forming a protective layer on the chip's front surface before mounting, and by pre-planning the exposure method for bonding pads. The protective layer is formed in advance to prevent damage during encapsulation, and the bonding pads are exposed through controlled removal of the protective layer after encapsulation, streamlining the overall process despite the additional protective steps.
Solution Approach 2:
The patent changes the physical state or properties of materials involved. The protective layer can be formed by depositing material in a different phase or state, and the exposure of bonding pads may involve controlled removal or transformation of the protective layer properties, allowing for easy access to bonding pads while maintaining protection during encapsulation.
3Object-affected harmful factors
If a protective layer is formed on the front surface of the chip, then the chip surface is protected during encapsulation, but the device structure becomes more complex
Solution Approach 1:
The patent employs a thin film protective layer deposited or laminated on the chip's front surface. This thin film provides effective protection against encapsulation material penetration while adding minimal structural complexity. The flexible nature of the thin film allows it to conform to the chip surface and be easily manipulated during subsequent processing steps.
Solution Approach 2:
The protective layer is formed using composite material approaches, combining the chip's base material with a protective coating material. This composite structure provides both the electrical and mechanical properties of the original chip and the protective properties of the coating material, creating a multi-functional layer that protects without significantly increasing overall device complexity.
Data Source
AI summary
The present disclosure discloses a method of packaging a chip and a chip package structure. The method of packaging the chip includes: forming a protective layer on a front surface of a chip to be packaged; mounting the chip to be packaged formed with the protective layer on the front surface on a first carrier, the back surface of the chip to be packaged facing upwards and a front surface thereof facing towards the first carrier; forming a first encapsulation layer, the first encapsulation layer being formed on the back surface of the chip to be packaged and the exposed first carrier; and detaching the first carrier to exposed the protective layer. In the present disclosure, when the chip to be packaged is mounted on the carrier after the protective layer is formed on the front surface thereof; and then the first encapsulation layer is formed on the chip to be packaged, the encapsulation material can be prevented from permeating to the gap between the chip to be packaged and the carrier and thereby damaging the circuit structure and/or the bonding pad on the chip to be packaged.