Chip Packaging Structure With Reinforced Heat-Dissipating Cover
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Solution Overview
Problem
Chip packaging structures, such as flip chip ball grid arrays, suffer from poor heat dissipation performance and are susceptible to warpage and separation of components due to mismatched thermal expansion coefficients and insufficient stiffness, which affects heat conduction efficiency during stress tests.
Innovation Solution
A chip packaging structure with a heat-generating chip, substrate, thermal conductive medium, and reinforcing structure, where the reinforcing structure forms a triangular stable structure to improve stiffness, preventing separation and enhancing heat dissipation by conducting heat rapidly to a heat dissipating cover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a chip packaging structure is applied widely (conventional packaging), then manufacturing simplicity is maintained, but heat dissipation performance deteriorates
Solution Approach 1:
The packaging structure is segmented into distinct functional layers: substrate layer, thermal conductive medium layer, and heat dissipating cover layer. This segmentation allows each layer to be optimized independently for its specific function while maintaining overall manufacturing simplicity.
Solution Approach 2:
A thermal conductive medium is introduced as an intermediary substance between the heat-generating chip and the heat dissipating cover. This intermediary efficiently transfers heat from the chip to the cover, significantly improving heat dissipation performance without complicating the manufacturing process.
2Ease of manufacture
If stiffness of the packaging structure is insufficient, then ease of manufacture is maintained, but warpage occurs due to mismatched thermal expansion coefficients
Solution Approach 1:
The heat dissipating cover is designed with locally varied thickness or material properties in different regions to provide differential stiffness support. This local quality enhancement prevents warpage in critical areas while maintaining overall structural simplicity and ease of manufacture.
Solution Approach 2:
The packaging structure employs composite material design combining substrate material, thermal conductive medium, and heat dissipating cover material with complementary thermal expansion coefficients. This composite structure compensates for thermal expansion mismatches and reduces warpage while maintaining manufacturing simplicity.
3Stability of the object's composition
If reinforcing structure is added to improve stiffness, then warpage resistance is improved, but device complexity increases
Solution Approach 1:
The heat dissipating cover is merged with the reinforcing structure into a single integrated component. This merging provides both heat dissipation function and structural reinforcement simultaneously, improving stiffness without increasing device complexity or adding separate reinforcing elements.
Solution Approach 2:
The heat dissipating cover serves multiple functions: it dissipates heat from the chip, provides structural reinforcement to prevent warpage, and acts as a protective enclosure. This multi-functionality eliminates the need for separate reinforcing structures, maintaining device simplicity while improving stiffness.
4Temperature
If thermal conductive medium is provided between chip and heat dissipating cover, then heat conduction efficiency is improved, but separation may occur due to deformation
Solution Approach 1:
The physical and chemical parameters of the thermal conductive medium are optimized, including its viscosity, adhesion strength, and thermal conductivity. By adjusting these parameters, the medium maintains strong adhesion to both the chip and heat dissipating cover under deformation, preventing separation while ensuring efficient heat conduction.
Solution Approach 2:
The thermal conductive medium acts as a cushioning layer that accommodates differential thermal expansion and mechanical deformation between the chip and heat dissipating cover. This beforehand cushioning prevents interface separation by absorbing stresses that would otherwise cause the thermal conductive medium to detach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The reinforcing structure enhances the stiffness of the chip packaging structure, reducing warpage and deformation, thereby maintaining efficient heat conduction and ensuring reliable operation during stress tests.
Implementation Method 1
As the thermal conductive medium is provided between the first surface of the heat-generating chip facing away from the substrate and the first region of the inner bottom wall of the heat dissipating cover, through a heat conduction effect served by the thermal conductive medium, heat produced by the heat-generating chip may be conducted rapidly to the heat dissipating cover
Data Source
Figure 1~2
Figure 3~5
Figure 6~8-1
AI summary
Disclosed are a chip packaging structure and a domain controller, including: a heat-generating chip; a substrate, the substrate carrying the heat-generating chip; a heat dissipating cover covering the substrate to form an accommodating space for the heat-generating chip enclosed by the substrate, an inner bottom wall of the heat dissipating cover, and an inner side wall of the heat dissipating cover; a thermal conductive medium provided between a first surface of the heat-generating chip and a first region of an inner bottom wall; and a reinforcing structure abutting against a second region of the inner bottom wall other than the first region and an inner side wall, wherein a second surface of the reinforcing structure facing the heat-generating chip meets that: the closer a part of the second surface is to the inner side wall, the further it is away from the second region in distance, and vice versa.