Chip Pad Decompression Structure for Distributed Force Protection
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Solution Overview
Problem
Conventional chip units used with close-fitting accessories cause discomfort due to concentrated weight distribution, leading to foreign body sensations and potential damage, reducing their effectiveness and lifespan.
Innovation Solution
A chip pad decompression structure comprising a pad, protective ring, and upper lid, where the protective ring disperses force between the pad and chip, enhancing cushioning and protecting the chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip unit is used with a close-fitting accessory, then the chip unit can emit far-infrared rays to the user's body, but the weight of the user will be concentrated on the chip, causing foreign body sensation and discomfort
Solution Approach 1:
The invention introduces a protective ring structure that segments the force transmission path between the pad and the chip. The protective ring divides the concentrated weight into distributed pressure points, preventing direct transmission of user weight to the chip while maintaining the close-fitting accessory's functionality.
Solution Approach 2:
The protective ring acts as an intermediary element between the pad and the chip. It mediates the force transmission by absorbing and distributing the user's weight, thereby protecting the chip from direct compression while allowing the close-fitting accessory to remain in contact with the user's body for far-infrared emission.
2Reliability
If the chip unit is used with a close-fitting accessory, then the chip unit can emit far-infrared rays to the user's body, but the concentrated weight will cause deformation or damage to the chip unit
Solution Approach 1:
The protective ring is installed beforehand between the pad and the chip to provide preventive cushioning. It absorbs the user's weight before it can reach the chip, preventing deformation or damage to the chip unit's structural integrity while maintaining the far-infrared emission function.
3Reliability
If the chip unit is used with a close-fitting accessory, then the chip unit can emit far-infrared rays to the user's body, but the concentrated weight will reduce the effect of the product
Solution Approach 1:
The protective ring is strategically positioned at the local area where weight concentration occurs between the pad and the chip. It provides localized force distribution only where needed, maintaining the overall product effectiveness for far-infrared emission while protecting the chip from damage that would reduce product effectiveness.
Data Source
AI summary
A chip pad decompression structure includes a pad, a protective ring, a chip, and an upper lid. A middle of one side of the pad has a raised portion. Another side of the pad has a recess. The protective ring is disposed in the recess of the pad. The protective ring has a through hole. The chip is disposed in the through hole of the protective ring and located in the recess of the pad. The upper lid is configured to cover the protective ring and the chip. The protective ring is disposed between the pad and the chip, which can disperse the force, improve a force-cushioning effect and protect the chip, so as to reduce a foreign body sensation and prolong the service life of the chip.