Display Chip Pad Buffer Structure for Mounting Pressure Cracks
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Solution Overview
Problem
The application of pressure during the mounting of a driving circuit chip on a display panel can cause deformation and cracks in the plastic substrate, leading to defects in the electrical connection between the chip pads and lines, increasing production energy and greenhouse gas emissions.
Innovation Solution
A display device with a pressure distribution structure made of organic insulating material is integrated between the chip pads and the driving circuit chip, distributing pressure and absorbing impact to prevent cracks and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pressure is applied to mount the driving circuit chip on the display panel, then the chip is securely attached, but the plastic substrate deforms and cracks occur in pads and lines
Solution Approach 1:
The patent introduces a buffer layer as an intermediary component between the driving circuit chip and the plastic substrate. This buffer layer absorbs and distributes the mounting pressure, preventing direct transmission of concentrated force to the substrate. The buffer layer acts as a mediator that enables secure chip attachment while protecting the substrate from deformation and cracking, thus resolving the contradiction between connection reliability and substrate strength.
2Ease of manufacture
If pressure is applied during chip mounting, then the chip is firmly fixed, but cracks occur in pads and lines increasing defect rate
Solution Approach 1:
The buffer layer serves as a mediator that enables easy chip mounting by providing a compliant surface for pressure application, while simultaneously preventing damage to electrical connections. The buffer layer allows the mounting process to proceed easily with pressure application, but distributes this pressure to prevent cracks in pads and lines, thus resolving the contradiction between manufacturing ease and connection reliability.
3Productivity
If high pressure is applied for chip mounting, then mounting speed is maintained, but substrate deformation occurs leading to higher defect rates and production energy consumption
Solution Approach 1:
The buffer layer acts as a mediator that enables high-pressure mounting without substrate damage, maintaining productivity while reducing energy loss. By distributing the pressure, the buffer layer prevents defects that would require rework or scrap, thereby reducing the overall energy consumption in production while maintaining fast mounting speeds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The pressure distribution structure effectively reduces the defect rate, lowering production energy and greenhouse gas emissions by ensuring reliable electrical connections and preventing substrate deformation.
Implementation Method 1
an anisotropic conductive film is used to mount the driving circuit chip on the display panel
Implementation Method 2
at least one pressure distribution structure vertically overlapping the driving circuit chip and disposed adjacent to at least one of the plurality of pad rows
Implementation Method 3
capable of efficiently absorbing an impact applied to chip pads of a display panel and lines around the chip pads
Data Source
AI summary
A display device includes a substrate including a display area and a non-display area around the display area; a chip pad area disposed on the non-display area of the substrate, wherein a plurality of chip pads are disposed in the chip pad area and are arranged in a plurality of rows to constitute a plurality of pad rows; a driving circuit chip mounted on the chip pad area; and at least one pressure distribution structure vertically overlapping the driving circuit chip and disposed adjacent to each of the plurality of pad rows.