Chip Supply Pallet Tension Ring Rotation Wafer Sheet Handling
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Solution Overview
Problem
Existing chip supply apparatuses face challenges in preventing chip destruction and reducing productivity due to the difficulty in maintaining tension on wafer sheets during interchange, leading to potential chip collision and increased mounting/detaching time.
Innovation Solution
A chip supply pallet with a tension ring and fixing member that maintains tension on the wafer sheet, allowing rotational displacement relative to a fixed position, and an optional restricting unit to control this displacement, preventing chip collision and eliminating the need for frequent wafer sheet mounting/detaching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the wafer sheet is detached and a new wafer sheet is molded during chip interchange, then the chip supply apparatus can be reset, but the mounting and detaching operations increase the time period and reduce productivity
Solution Approach 1:
The wafer sheet is pre-mounted on the pallet before being transferred to the chip supply apparatus. The tension ring is pre-applied to maintain tension on the wafer sheet throughout the transfer process. This preliminary preparation eliminates the need for time-consuming mounting operations at the chip supply apparatus, thereby reducing downtime and improving productivity while ensuring the apparatus is properly reset with each new pallet
2Ease of operation
If the wafer sheet is slackened during interchange, then the wafer sheet can be easily removed, but the chips may collide and cause brittle edge or corner portion destruction
Solution Approach 1:
The tension ring is applied in advance to the wafer sheet before removal from the chip supply apparatus. This pre-application of the tension ring ensures that the wafer sheet remains under tension during the entire removal and transfer process, preventing chip collision and damage. The ease of operation is maintained because the tension ring is already in place to facilitate smooth removal without requiring additional tensioning steps
Solution Approach 2:
The tension ring acts as an intermediary element that maintains the mechanical state of the wafer sheet during transfer operations. By keeping the wafer sheet under continuous tension through this intermediary component, the system prevents harmful chip collisions during wafer sheet manipulation while still allowing easy removal when needed
3Object-affected harmful factors
If the wafer sheet is held under continuous tension, then chip collision is prevented, but the wafer sheet interchange process becomes more complex
Solution Approach 1:
The system is segmented into a reusable pallet with an integrated tension ring mechanism and the chip supply apparatus. The pallet serves as a self-contained unit that maintains tension on the wafer sheet independently, simplifying the overall interchange process. This segmentation allows the tension-maintaining function to be built into the pallet itself, reducing the complexity of the chip supply apparatus while ensuring continuous chip protection
Solution Approach 2:
The pallet acts as an intermediary carrier that bridges the wafer sheet storage and the chip supply apparatus. By incorporating the tension ring into the pallet design, the system maintains continuous tension on the wafer sheet throughout the entire workflow without requiring complex tensioning mechanisms in the chip supply apparatus, thus preventing chip collision while keeping the device relatively simple
Data Source
AI summary
To provide a chip supply pallet preventing destruction of a chip and preventing a reduction in a productivity from being brought about in exchanging a wafer sheet, the chip supply pallet includes a first member 33 having a tension ring 51 brought into contact with a wafer sheet from a lower side, and a fixing member 54 of fixing a ring frame holding the wafer sheet on an inner side on a lower side of the wafer sheet brought into contact with the tension ring 51, and a second member 34 having a fixed portion for fixing to a predetermined position of a chip supply apparatus and a held portion 36 of being held when the chip interchanging pallet 3 is transferred, and the first member 33 is configured to be able to rotationally displace relative to the second member 34 fixed to the predetermined position of the chip supply apparatus.