Chip Part With Embedded Inductor And Resistor
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Solution Overview
Problem
Existing chip designs face challenges in integrating multiple passive elements like coils, capacitors, and resistors on a common substrate without increasing substrate size, while maintaining high performance and flexibility in circuit configurations.
Innovation Solution
A chip part design that includes a substrate with embedded and surface-mounted conductive members forming passive elements, such as coils and capacitors, allowing for flexible circuit configurations and reduced internal resistance, and utilizing a resistor portion conductive member film for adjustable resistance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple passive elements are integrated on a common substrate, then circuit functionality is improved, but substrate size increases
Solution Approach 1:
The patent transitions from planar surface mounting to three-dimensional embedding within the substrate. Conductive members are placed in trenches and wells formed within the substrate volume, utilizing the depth dimension rather than only the surface area. This allows multiple passive elements to be integrated without increasing the substrate's planar footprint.
Solution Approach 2:
The patent embeds conductive members within trenches and wells that are formed inside the substrate structure. The passive elements are nested within the substrate volume, with conductive members positioned in recesses and cavities. This nesting approach allows multiple elements to occupy overlapping or adjacent three-dimensional spaces without requiring additional substrate area.
2Ease of manufacture
If conductor film is patterned by etching, then manufacturing process is simplified, but manufacturing precision deteriorates
Solution Approach 1:
The patent forms trenches and wells within the substrate before embedding the conductive members. These pre-formed structures serve as precise templates that guide the subsequent conductive material deposition. The trenches and wells are created with controlled dimensions and positions, ensuring high manufacturing precision for the final passive element patterns.
Solution Approach 2:
The patent introduces trenches and wells as intermediary structures between the substrate and the conductive members. These intermediary features act as precision molds or formers that define the exact shape, size, and position of the embedded conductive elements. The intermediary structures enable precise pattern formation while maintaining a simple overall manufacturing process.
Data Source
AI summary
A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.