Chip Part Sidewall Insulating Film Formation
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Solution Overview
Problem
Existing chip part manufacturing methods face challenges in forming a high-quality sidewall insulating film that effectively protects the functional element and ensures excellent adhesive and insulation properties.
Innovation Solution
The method involves forming concavo-convex portions on the substrate's sidewall, followed by a self-aligned sidewall insulating film coating that fills these features, enhancing the contact area and adhesive properties, and includes a segmentation step to form individual chip parts with improved insulation and electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a sidewall insulating film is formed on a smooth substrate sidewall, then the manufacturing process is simple, but the adhesive properties and insulation effectiveness are insufficient
Solution Approach 1:
The substrate sidewall is given different local properties through concavo-convex portions, creating regions with varying surface characteristics that enhance insulating film adhesion in specific areas while maintaining overall structural integrity
Solution Approach 2:
The smooth substrate sidewall is transformed into a curved surface with concavo-convex portions, increasing the surface area and providing mechanical interlocking features that improve insulating film adhesion
2Reliability
If the substrate sidewall is coated with a simple insulating film, then the manufacturing process is easy, but the insulation effectiveness is insufficient
Solution Approach 1:
The insulating film is applied to cover both the concave and convex portions of the sidewall, creating regions of varying film thickness and density that collectively provide superior insulation effectiveness
Solution Approach 2:
The insulating film formation process addresses the three-dimensional concavo-convex sidewall structure, ensuring complete coverage and effective insulation by conforming to the complex surface geometry
3Productivity
If the substrate is cut into individual chip parts after insulating film formation, then individual chip parts are obtained, but the insulating film may be damaged at cut edges
Solution Approach 1:
The insulating film is formed on the substrate sidewall before the cutting process, providing pre-established protection that prevents edge damage during subsequent segmentation operations
Solution Approach 2:
The insulating film acts as a protective cushion layer that absorbs mechanical stresses during cutting, preventing direct contact between the cutting tool and the substrate edge, thereby preserving insulating film integrity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a chip part with enhanced protection of the functional element, improved insulation, and effective electrical connections, while allowing for easy and excellent sidewall insulating film formation.
Implementation Method 1
a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film
Data Source
AI summary
A chip part includes a substrate that has an upper surface, a lower surface positioned on an opposite side of the upper surface, and a sidewall by which the upper surface and the lower surface are connected together and that has a plurality of concavo-convex portions formed on the sidewall from a side of the upper surface toward a side of the lower surface, a functional element formed at the side of the upper surface of the substrate, a first external electrode and a second external electrode that are arranged at the upper surface of the substrate so as to be electrically connected to the functional element, and a sidewall insulating film with which the sidewall of the substrate is coated so as to fill the plurality of concavo-convex portions formed on the sidewall of the substrate with the sidewall insulating film.