Chip Packaging Structure Integrating Passive Components
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Solution Overview
Problem
Conventional chip packaging structures face inefficiencies due to the separate manufacturing of passive components and integrated circuits, leading to increased material costs and inconsistent quality, as well as high resistance/capacitance loading effects that hinder operational efficiency.
Innovation Solution
A chip packaging structure where a passive component is integrated directly on the chip with electrodes connected to bonding pads and metal lines, allowing for reduced resistance/capacitance load effects through a conductive layer connection, thereby enhancing operational efficiency and speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If passive components are separately manufactured from the chip and integrated through packaging process, then manufacturing consistency and quality control are improved, but device complexity and material costs increase
Solution Approach 1:
The patent merges the passive component and chip into a single integrated structure where the passive component is formed directly on the chip substrate. This eliminates the need for separate packaging processes and reduces structural complexity while maintaining manufacturing consistency through a unified fabrication process.
2Volume of moving object
If passive components are manufactured within the same chip, then device volume is reduced, but material costs and quality consistency deteriorate
Solution Approach 1:
The patent combines passive and active components on the same chip substrate using a unified fabrication process, achieving volume reduction while maintaining quality consistency through integrated manufacturing rather than separate processes.
3Strength
If a gap is kept between passive components and chip during die bonding, then collision prevention is achieved, but resistance/capacitance loading effect increases
Solution Approach 1:
The patent merges the passive component structure with the chip substrate, eliminating the need for separation gaps. The passive component electrodes are directly connected to bonding pads through conductive layers on the same substrate, reducing resistance/capacitance loading effects while the integrated structure inherently prevents collision during bonding.
4Reliability
If extensive conductive lines are used to connect passive components and integrated circuit, then electrical connection is achieved, but power consumption and noise increase
Solution Approach 1:
The patent merges the connection path by forming conductive layers directly on the chip substrate that connect passive component electrodes to bonding pads without requiring extensive external conductive lines. This reduces the length and complexity of current paths, thereby reducing power consumption and noise while maintaining reliable electrical connection.
Data Source
AI summary
A chip packaging structure includes a chip, a passive component, and at least two metal lines. In the chip, first bonding pads, second bonding pads and connecting pads are disposed above an integrated circuit, and the second bonding pads and the connecting pads are separated from the integrated circuit. The second bonding pads are electrically connected to the corresponding connecting pads, respectively. The passive component is disposed on the chip, and includes two electrodes that are respectively electrically connected to and adhered to one of the corresponding connecting pad. The metal lines are disposed on the chip, and have one end thereof respectively connected to the second bonding pads, and the other end respectively connected to the first bonding pads.