Chip Patch Antenna High Dielectric Layer 5G Signal Loss
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Solution Overview
Problem
Millimeter wave communications, such as 5G, face significant signal loss due to absorption in high-frequency bands, leading to decreased communication quality, requiring specialized antenna technologies to enhance gain and directivity while maintaining energy efficiency.
Innovation Solution
The design incorporates a chip patch antenna with a ground plane, feed line, insulating layer, and dielectric layer with a high dielectric constant, along with edge and upper edge coupling patterns, to improve bandwidth and directivity, and reduce energy loss, featuring a dielectric layer with a thickness greater than the insulating layer to isolate components and enhance electromagnetic coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a conventional antenna design is used in high-frequency bands, then the antenna structure is simple, but signal loss increases due to absorption
Solution Approach 1:
The patent employs a multi-layer composite structure consisting of a substrate layer, a first dielectric layer with first dielectric constant, and a second dielectric layer with second dielectric constant. This composite material approach allows optimization of electromagnetic wave propagation by combining materials with different dielectric properties, thereby reducing signal loss in high-frequency bands while maintaining a manageable structural complexity.
Solution Approach 2:
The patent applies local quality by using different dielectric constants in different regions of the antenna structure. The first dielectric layer has a first dielectric constant and the second dielectric layer has a second dielectric constant, allowing each region to be optimized for its specific function in electromagnetic wave propagation, thus reducing overall signal loss without requiring complete structural redesign.
2Reliability
If the dielectric layer thickness is increased to isolate components, then component isolation improves, but antenna size increases
Solution Approach 1:
The patent utilizes parameter changes by adjusting the thickness of dielectric layers and their dielectric constants to achieve optimal component isolation. By carefully selecting the thickness parameters of the first and second dielectric layers, the design achieves sufficient electrical isolation between components while minimizing the overall antenna volume, avoiding excessive size increase.
3Productivity
If coupling patterns are added to enhance electromagnetic coupling, then bandwidth and directivity improve, but manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the coupling structure into distinct first and second dielectric layers with different dielectric constants. This segmented approach allows each layer to be optimized independently for electromagnetic coupling performance, achieving improved bandwidth and directivity while maintaining manufacturing feasibility through modular construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the antenna's gain, directivity, and bandwidth, reducing energy loss and size, while maintaining energy efficiency, effectively addressing signal absorption issues in high-frequency bands.
Implementation Method 1
a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than a dielectric constant of the insulating layer
Data Source
AI summary
An antenna apparatus includes: a ground plane having a through-hole; a feed line disposed below the ground plane; an insulating layer disposed between the feed line and the ground plane; a feed via electrically connected to the feed line, and passing through the through-hole; and a chip patch antenna electrically connected to the feed via. The chip patch antenna includes: a patch antenna pattern electrically connected to the feed via; an upper coupling pattern disposed above the patch antenna pattern; edge coupling patterns surrounding a portion of the patch antenna pattern; upper edge coupling patterns surrounding a portion of the upper coupling pattern; and a dielectric layer disposed in a first region between the patch antenna pattern and the upper coupling pattern, and in a second region between the edge coupling patterns and the upper edge coupling patterns, and having a dielectric constant higher than that of the insulating layer.