Semiconductor Chip Peeling Blade for Bond Strength Measurement
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Solution Overview
Problem
Existing methods for measuring peeling strength, such as blade insertion, often fail to easily separate firmly bonded semiconductor chips from substrates, leading to difficulties in evaluating bonding strength.
Innovation Solution
A peeling method and apparatus using a blade with a first tool part having a first acute angle and a second tool part, where the first tool part is inserted along the substrate's surface toward the semiconductor chip's chamfered outer peripheral edge, and the second tool part applies a force away from the substrate to facilitate easy peeling, allowing measurement of bonding strength based on the peeling length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single blade is used for blade insertion method, then the measurement setup is simple, but the substrates are not easily peeled apart when firmly bonded
Solution Approach 1:
The blade is divided into two distinct tool parts: a first tool part (blade) for insertion along the bonding surface, and a second tool part for applying peeling force. This segmentation allows each part to perform its specific function optimally, resolving the contradiction between simple setup and effective peeling.
Solution Approach 2:
The first tool part acts as an intermediary by being inserted into the bonding surface to create a gap or crack, which then allows the second tool part to apply peeling force more effectively. This intermediary action facilitates the peeling process without requiring excessive direct force.
2Device complexity
If a single blade is used for blade insertion method, then the device structure is simple, but the bonding strength cannot be measured when substrates re-bond after peeling
Solution Approach 1:
By separating the blade into two functional parts with different orientations, the system can effectively peel substrates that would otherwise re-bond, ensuring reliable measurement results while maintaining relatively simple device structure.
Solution Approach 2:
Instead of applying peeling force directly perpendicular to the bonding surface, the second tool part applies force at an angled orientation relative to the bonding surface, which prevents re-bonding and ensures reliable measurement of bonding strength.
3Device complexity
If a blade with larger angle is used, then the blade structure is simpler, but friction increases and entry into bonding surface becomes difficult
Solution Approach 1:
The blade angle of the first tool part is specifically optimized to be between 5 degrees and 45 degrees relative to the bonding surface. This parameter optimization reduces friction during insertion while maintaining structural simplicity, allowing easy entry into the bonding surface.
Data Source
AI summary
A measurement method measures bonding strength by peeling off a semiconductor chip bonded to a main surface of a substrate by using a blade having a first tool part, which has a blade angle as a first acute angle, and a second tool part provided on first tool part. The method includes: inserting first tool part along main surface toward a chamfered outer peripheral edge part of chip; while first tool part is inserted into the edge part, peeling off chip from substrate by bringing second tool part provided on first tool part into contact with the edge part of chip and applying a force to chip away from substrate; and measuring bonding strength between substrate and chip based on a length from a contact point where first tool part or second tool part comes into contact with chip to a point where chip and substrate are peeled apart.