Chip-Level Personalization Using Secure Configuration Certificates
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Solution Overview
Problem
Existing chip-level personalization processes for MCUs and MPUs are costly due to the need for multiple photolithography masks and complex hardware variations, lacking scalable solutions that allow for efficient customization and secure configuration management.
Innovation Solution
A method for implementing a scalable chip-level personalization process using a unique configuration key pair and certificate system, enabling secure, project-specific configuration files for programmable ICs, allowing common hardware dies to be customized per customer and project, with cryptographic protection to prevent fraudulent reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple photolithography masks are used for different MCU/MPU product variations, then manufacturing precision and product customization are improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent implements a universal base silicon die design that can serve multiple product variations through software configuration rather than hardware reconfiguration. A single mask set produces the base die, and different product specifications are achieved through configuration files that program the same hardware architecture with different parameters (memory size, peripheral enabled/disabled states, performance profiles), eliminating the need for multiple specialized masks.
Solution Approach 2:
The patent changes product specifications by modifying software parameters in configuration files rather than changing physical hardware parameters. Configuration files contain parameter sets that define memory sizes, enabled peripherals, performance characteristics, and other product-specific attributes, allowing the same silicon die to produce multiple product variants through parameter variation alone.
2Adaptability or versatility
If multiple photolithography masks are used for different MCU/MPU product variations, then product customization is improved, but manufacturing cost increases
Solution Approach 1:
The patent implements a universal base silicon die design that can serve multiple product variations through software configuration rather than hardware reconfiguration. A single mask set produces the base die, and different product specifications are achieved through configuration files that program the same hardware architecture with different parameters (memory size, peripheral enabled/disabled states, performance profiles), eliminating the need for multiple specialized masks.
Solution Approach 2:
The patent uses configuration files as software copies that define product variations. Instead of creating new physical hardware designs for each product variant, the system creates software configuration copies that can be replicated and distributed to program identical silicon dies with different specifications, dramatically reducing manufacturing complexity and cost.
3Productivity
If configuration files are shared across multiple programmable ICs, then productivity and cost-effectiveness are improved, but security and reliability worsen due to potential fraudulent reuse
Solution Approach 1:
The patent segments the configuration system into three distinct components: (1) a universal configuration file template defining base parameters, (2) a unique cryptographic signature specific to each product batch or customer, and (3) the silicon die hardware that executes the configuration. This segmentation allows the configuration file to be shared and reused across multiple ICs while the cryptographic signature ensures that only authorized configurations can be applied to specific batches, preventing fraudulent reuse.
Solution Approach 2:
The patent introduces a cryptographic signature as an intermediary between the shared configuration file and the programmable ICs. The signature acts as a mediator that verifies the authenticity and intended usage of the configuration file, allowing the same configuration to be safely applied to multiple ICs while preventing unauthorized or fraudulent configurations from being executed.
Data Source
AI summary
Methods, systems, and computer program products for implementing a scalable chip-level personalization process. A request for a batch of programmable integrated circuits (ICs) is received. The request includes a set of configuration elements to be implemented for each programmable IC. A unique configuration key pair corresponding to the batch of programmable ICs based on the set of configuration elements is determined. A corresponding configuration certificate is obtained in response to submitting the unique configuration key pair to a Certificate Authority for signature. A configuration file is obtained and updated by encrypting and signing the configuration file based on the unique configuration key pair. The batch of programmable ICs are generated. The configuration certificate for each programmable IC is encrypted. The batch of the programmable ICs, the updated configuration file, and the corresponding batch of encrypted configuration certificates is provided to a client device.