Semiconductor Chip Pickup Collet With Thin Edge Anti-Sticking Structure
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Solution Overview
Problem
Conventional collets for picking up semiconductor chips from a film often cause adjacent chips to be vertically erected and stuck in the peripheral region, leading to damage during the delamination process.
Innovation Solution
A collet design featuring a base with a resilient plate at its edge portion, where the plate is thin enough to prevent interference and sticking of vertically erected chips, and a holder with vacuum grooves for secure chip pickup without damaging adjacent chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the holder has a uniform thickness throughout, then the structural strength is maintained, but vertically erected semiconductor chips in the peripheral region get stuck in the holder and cause damage
Solution Approach 1:
The holder is designed with non-uniform thickness: the pickup region (central area) maintains sufficient thickness for structural strength and vacuum holding, while the peripheral region has reduced thickness to prevent vertically erected chips from getting stuck. This local differentiation resolves the contradiction by optimizing each region's thickness for its specific function.
2Object-affected harmful factors
If the holder thickness is reduced in the peripheral region, then chip sticking is prevented, but the structural strength may be compromised
Solution Approach 1:
The holder's thickness is locally optimized: the pickup region maintains sufficient thickness for structural integrity and vacuum holding function, while the peripheral region has reduced thickness specifically to prevent chip sticking. This localized differentiation allows each region to fulfill its specific function without compromising overall structural strength.
3Object-affected harmful factors
If a resilient plate is added to the base edge portion, then chip sticking is prevented, but the device complexity increases
Solution Approach 1:
A resilient plate is added to the base's edge portion to create a flexible barrier that prevents vertically erected chips from getting stuck in the holder. This thin film structure provides the necessary compliance and protection while adding minimal complexity to the overall device.
Solution Approach 2:
The resilient plate acts as an intermediary element between the base and the holder, providing a compliant interface that prevents chip sticking. This mediator component absorbs the interference issue without requiring fundamental redesign of the main holder structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents the sticking and potential damage of semiconductor chips by ensuring that vertically erected chips do not interfere with the holder, thereby safeguarding other chips during the pickup process.
Implementation Method 1
The holder may be attached to the whole surface of the base. The holder may have a pickup region configured to pick up the semiconductor chip and a peripheral region configured to surround the pickup region.
Implementation Method 2
A plurality of first vacuum holes may be formed in the base and the holder. The second vacuum holes may be connected to the first vacuum holes. The vacuum groove may be formed at the first surface of the holder to connect the second vacuum holes from each other.
Data Source
AI summary
A collet for pickup a semiconductor chip may include a base and a holder. The base may have a first surface oriented toward the semiconductor chip and a second surface opposite to the first surface. The holder may be arranged at a central portion of the first surface of the base to fix the semiconductor chip using vacuum. An edge portion of the first surface of the base may be exposed. Thus, any structure may not exist in the edge portion of the base corresponding to a peripheral region of the collet so that a peripheral semiconductor chip vertically erected in picking the semiconductor chip from a film may not interfere with the holder. As a result, the vertically erected semiconductor chip may not be stuck in the holder to prevent damages of other semiconductor chip by the vertically erected semiconductor chip.