Semiconductor Chip Pickup via Stage Groove Evacuation
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Solution Overview
Problem
Existing methods for picking up semiconductor chips from adhesive sheets often result in chips being inclined, leading to potential chipping or scratching, due to uneven deformation of the adhesive sheet, which is difficult to control and varies based on surface roughness and adhesion properties.
Innovation Solution
A fabrication method and system that uses a stage with grooves and a suction mechanism to evacuate the adhesive sheet, allowing the chip to be held only at top portions, reducing adhesion and preventing inclination, thus enabling safe pickup without tools like needles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a needle is used to push up the semiconductor chip from the bottom surface, then the contact area with the adhesive sheet is reduced, but the chip may be chipped or scratched due to mechanical contact
Solution Approach 1:
The patent replaces the mechanical needle-pushing system with a suction-based pneumatic system. The suction cup applies negative pressure to the chip surface, eliminating the need for mechanical contact that causes chipping and scratching. This substitution of mechanical force with pneumatic pressure resolves the contradiction between ease of operation and prevention of chip damage.
Solution Approach 2:
The invention employs pneumatic principles by using a suction cup connected to a vacuum source. The suction cup creates a pressure difference to hold and lift the chip without mechanical contact. This pneumatic approach allows for gentle chip handling while maintaining operational effectiveness, directly addressing the harm caused by mechanical needle contact.
2Reliability
If suction is applied to the adhesive sheet to deform it for chip pickup, then the chip can be held securely, but the deformation is uneven and difficult to control
Solution Approach 1:
The suction cup design concentrates the suction force on a localized area (the chip surface) rather than distributing it across the entire adhesive sheet. This localized application of negative pressure ensures that only the chip is held securely while the adhesive sheet remains relatively undisturbed, achieving reliable chip holding without uneven deformation.
Solution Approach 2:
The suction cup is designed to make contact with the chip surface before full suction is applied. This preliminary positioning ensures that the chip is properly oriented and secured before the adhesive sheet deforms, allowing for controlled and predictable chip pickup while minimizing uncontrolled deformation of the adhesive sheet.
3Productivity
If the chip thickness is reduced to 50 μm to 100 μm or less, then the performance and cost are improved, but the chip becomes more susceptible to damage during handling
Solution Approach 1:
The patent replaces mechanical contact methods (needles, probes) with a pneumatic suction system that applies distributed pressure across the chip surface. This substitution eliminates point-loading stresses that would be particularly damaging to thinned chips, allowing safe handling of chips with thickness reduced to 50-100 μm while maintaining the performance and cost benefits of thinning.
Solution Approach 2:
The invention changes the pressure application parameter from concentrated mechanical force to distributed pneumatic pressure. By controlling the negative pressure magnitude and distribution across the chip surface, the system can securely hold thinned chips without exceeding their reduced mechanical strength limits, enabling safe handling of high-performance thin chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents semiconductor chips from being chipped or scratched by ensuring they are not inclined during pickup, allowing for high-quality removal from adhesive sheets without the need for pushing tools.
Implementation Method 1
a suction means applying suction to the semiconductor chip; applying suction to the semiconductor chip held at the top portions by the suction means to pick up the semiconductor chip
Implementation Method 2
an evacuation means; making the semiconductor chip held at top portions formed by the end portions on the opening side of the grooves on the stage with the adhesive sheet put in between with a space, surrounded by the adhesive sheet contacting the stage and the grooves on the stage, being evacuated by the evacuation means
Data Source
AI summary
In aspects of the invention, a holding stage of a pick up system can include a first stage on which a semiconductor chip is mounted with an adhesive sheet put in between, a second stage supporting the first stage, and an evacuation pipe. The first stage can be provided with a plurality of grooves, projections each being formed with side walls of adjacent grooves, and air holes connected to the grooves. The semiconductor chip can be mounted on the first stage so that the whole end portion of the semiconductor chip does not position on one groove. Then, a closed space surrounded by the adhesive sheet and the first and second stages and can be evacuated to make the semiconductor chip held on the projections. Thereafter, the semiconductor chip can be picked up by a collet.