Semiconductor Chip Pickup Stage for Mixed-Size Die Peeling

Solution Overview

Problem

Existing semiconductor chip pickup apparatuses face challenges in efficiently picking up chips of varying sizes from a dicing sheet, as large chips require wider protrusions to prevent excessive bonding, while small chips require narrower protrusions to prevent peeling and flying apart, leading to inconsistent peeling performance when mixed sizes are present.

Innovation Solution

A pickup apparatus with a stage featuring a combination of first and second protruding portions of different heights or elastic moduli, allowing for adjustable peeling points to accommodate chips of different sizes, ensuring effective peeling without excessive or insufficient bonding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If the interval between protruding objects on the stage is widened to accommodate large-sized semiconductor chips, then large chips can be properly peeled off, but small chips cannot be held securely and fly apart

Engineering Contradiction:

Improveaccommodation of large-sized chipsVSAvoidholding of small-sized chips

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent applies local quality by providing protruding objects with different sizes on the stage. Larger protruding objects are positioned in regions where large semiconductor chips are located, while smaller protruding objects are positioned where small chips are located. This allows each chip size to interact with appropriately sized protrusions, ensuring secure holding for small chips and proper peeling for large chips simultaneously.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent implements dynamics by making the protruding objects elastically deformable. The protruding objects can dynamically adjust their deformation degree based on the size and position of the semiconductor chip. When a small chip is placed, the protrusion deforms less to provide secure holding; when a large chip is placed, the protrusion can deform more to facilitate peeling, thus adapting to different chip sizes dynamically.

Inventive Principle:

Principle #15Dynamics

2Reliability

If the interval between protruding objects on the stage is reduced to hold small-sized semiconductor chips, then small chips can be securely held, but large chips cannot be properly peeled off

Engineering Contradiction:

Improveholding of small-sized chipsVSAvoidaccommodation of large-sized chips

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by providing protruding objects with different sizes on the stage. Larger protruding objects are positioned in regions where large semiconductor chips are located, while smaller protruding objects are positioned where small chips are located. This allows each chip size to interact with appropriately sized protrusions, ensuring secure holding for small chips and proper peeling for large chips simultaneously.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent implements dynamics by making the protruding objects elastically deformable. The protruding objects can dynamically adjust their deformation degree based on the size and position of the semiconductor chip. When a small chip is placed, the protrusion deforms less to provide secure holding; when a large chip is placed, the protrusion can deform more to facilitate peeling, thus adapting to different chip sizes dynamically.

Inventive Principle:

Principle #15Dynamics

3Reliability

If the number of protruding objects is increased to provide multiple bonding points for small chips, then small chips are held securely, but the complexity of the stage structure increases

Engineering Contradiction:

Improveholding of small-sized chipsVSAvoidstage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by varying the size parameter of the protruding objects rather than changing their number. By providing protruding objects of different sizes at different positions, the system achieves secure holding for small chips without needing to increase the total number of protrusions. This maintains simpler stage structure while still providing appropriate bonding points for each chip size.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus enables reliable peeling of semiconductor chips of varying sizes by optimizing the number of bonding points, preventing chips from flying apart or being difficult to remove, thus ensuring consistent and efficient chip pickup.

Implementation Method 1

a suction unit configured to vacuum-suck a space between the dicing sheet and the stage

Methodology Applied

Scientific EffectVacuum suction: Vacuum

Data Source

PatentUS20240178048A1Apparatus for manufacturing semiconductor device and method of manufacturing semiconductor device

Publication Date: 2024.05.30 MITSUBISHI ELECTRIC CORP

AI summary

An apparatus for manufacturing semiconductor device includes a pickup apparatus. The pickup apparatus includes: a stage including a plurality of protruding portions disposed so as to face a back surface of a dicing sheet to which a semiconductor chip is attached; and a suction unit configured to vacuum-suck a space between an outer frame, the dicing sheet, and the stage. The plurality of protruding portions includes a plurality of first protruding portions and a plurality of second protruding portions different in height or vertical elastic modulus from each other.