Semiconductor Package Pin Density Layout for Immersion Cooling
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving improved product reliability, particularly in high-power applications like datacenters, where heat dissipation and electrical connectivity are critical.
Innovation Solution
The semiconductor package design incorporates a package substrate, interposer, and multiple semiconductor chips with strategically arranged pins and protrusions on the top surface, allowing for enhanced electrical connectivity and heat dissipation through immersion cooling, with varying distances and arrangements of pins and protrusions to optimize thermal conductivity and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If uniform pin spacing is used across the entire chip surface, then manufacturing simplicity is maintained, but thermal conductivity and electrical connectivity are insufficient in high-power regions
Solution Approach 1:
The patent applies local quality by implementing non-uniform pin spacing where pins are densely spaced in first regions (high-power generation areas) and sparsely spaced in second regions (low-power areas). This localized differentiation optimizes thermal conductivity and electrical connectivity in high-power regions while maintaining overall package reliability, directly resolving the contradiction between reliability improvement and device complexity.
2Temperature
If pins are densely spaced to improve thermal conductivity, then heat dissipation efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The patent implements local quality by concentrating dense pin spacing only in first regions where high-power generation occurs, while using sparse pin spacing in second regions. This localized approach improves heat dissipation efficiency where needed without imposing stringent manufacturing precision requirements across the entire chip surface, thus resolving the contradiction between temperature control and manufacturing precision.
3Reliability
If multiple regions with different pin densities are implemented, then thermal management is optimized, but device complexity increases
Solution Approach 1:
The patent applies local quality by dividing the chip surface into first regions and second regions with different pin densities according to power generation characteristics. This region differentiation optimizes thermal management efficiency by matching pin density to local heat generation, while the systematic approach to region definition and pin arrangement keeps device complexity manageable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and efficiency of semiconductor packages by improving thermal conductivity and electrical connectivity, enabling effective heat dissipation and power management in high-power applications.
Implementation Method 1
improving thermal conductivity and electrical connectivity, enabling effective heat dissipation
Implementation Method 2
the plurality of first pins and the plurality of second pins include a metal material
Data Source
AI summary
A semiconductor package includes a package substrate, an interposer on the package substrate and including first upper pads, the first upper pads including a first set of upper pads and a second set of upper pads, a first semiconductor chip on the interposer and comprising first lower pads respectively connected to the first set of upper pads, a plurality of first pins on a first top surface of the first semiconductor chip and substantially uniformly spaced apart by a first distance, and a plurality of second pins on the first top surface of the first semiconductor chip and substantially uniformly spaced apart by a second distance that is different from the first distance, where the first top surface of the first semiconductor chip includes a first region and a second region that does not overlap the first region.