Chip Pin Power Sequencing for Automated Reliability Testing
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Solution Overview
Problem
Current chip testing solutions rely heavily on manual testing, which is inefficient and lacks intelligence, leading to low testing efficiency and increased manpower and time consumption.
Innovation Solution
A chip testing device and method that utilizes a processor to acquire pin connection control information to intelligently control the sequence of connection between chip pins and a power supply module, including the use of a switch matrix and discharge units to simulate various working conditions and improve testing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual testing methods are used for chip testing, then the testing process is simple to implement, but the testing efficiency is low and manpower consumption is high
Solution Approach 1:
The patent replaces manual mechanical testing operations with an automated testing system comprising a processor, switch matrix, and power supply module. The processor automatically controls the switch matrix to connect chip pins to power supply units according to predefined sequences, eliminating manual intervention and significantly improving testing efficiency while maintaining high intelligence level.
Solution Approach 2:
The testing system is designed to autonomously perform testing operations without external intervention. The processor automatically acquires pin connection control information, controls the switch matrix to establish connections, and manages the power supply sequence based on stored testing programs, enabling the system to serve itself and achieve high automation.
2Reliability
If pin connection sequence is not controlled, then the testing setup is simpler, but abnormal chips may be released due to insufficient testing under critical working conditions
Solution Approach 1:
The system pre-stores pin connection control information and testing sequences in the processor before actual testing begins. The critical connection sequences that create extreme working conditions are predetermined and stored, allowing the system to automatically execute them during testing without requiring complex real-time decision-making, thus ensuring reliability while managing complexity.
Solution Approach 2:
The system changes the connection parameters by controlling different pins to be connected to power supply units in specific sequences. By varying the connection sequence and timing, the system creates different working conditions including extreme voltage differentials, enabling comprehensive testing of chip reliability under various scenarios without requiring physically complex testing apparatus.
3Reliability
If multiple pins are connected to power supply simultaneously, then the testing setup is simpler, but the chip may not experience critical working conditions that cause damage
Solution Approach 1:
The power supply connection process is segmented into sequential steps where pins are connected one by one according to a predefined sequence rather than simultaneously. The switch matrix divides the connection process into discrete controllable stages, allowing the system to create critical working conditions with voltage differentials while maintaining efficient automated testing through programmable sequence control.
Data Source
AI summary
Embodiments of the present application provide a chip testing device and a method for testing chips. The device has a processor that can read information about how and in what order to connect certain pins of a chip to a power source. Based on that information, the processor controls the connections to follow the correct sequence. This approach helps make chip testing faster and more efficient.