Semiconductor Chip Positioning Pin for Precise Solder Alignment
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Solution Overview
Problem
Highly pixelated optoelectronic semiconductor chips require precise alignment and reliable electrical contacting with tight alignment tolerances, which existing methods struggle to achieve, especially when dealing with small distances between contact pins and ensuring mechanical stability and reliability of electrical contacts.
Innovation Solution
A method involving a semiconductor chip with protruding contact pins and a positioning pin that narrows in the direction away from the underside, combined with a connection carrier featuring corresponding recesses filled with solder material, where the semiconductor chip is aligned and secured using the positioning pin and soldered into place, allowing for precise alignment and stable fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional mounting methods are used for highly pixelated optoelectronic semiconductor chips, then the contact pins can be connected electrically, but the alignment precision is insufficient and mechanical stability is compromised due to small distances between contact pins
Solution Approach 1:
A positioning pin made of mechanically robust material (e.g., tungsten or molybdenum) is introduced as an intermediary element between the semiconductor chip and the carrier. This positioning pin, which protrudes further than the contact pins and features a narrowing geometry, serves as a dedicated mechanical alignment reference that does not interfere with the electrical contact function of the contact pins, thereby achieving both precise alignment and mechanical stability
Solution Approach 2:
The functional separation between electrical contacting and mechanical positioning is achieved by dividing the chip structure into distinct elements: contact pins for electrical connection and a separate positioning pin for mechanical alignment. This segmentation allows each element to be optimized for its specific function, with the positioning pin providing alignment precision without compromising the electrical contact integrity
2Productivity
If the distance between contact pins is reduced to achieve higher pixelation, then more pixels can be integrated, but the alignment tolerance becomes tighter and more difficult to achieve
Solution Approach 1:
The positioning pin acts as an intermediary alignment reference that establishes a mechanical datum independent of the contact pin spacing. By providing a dedicated positioning feature with larger dimensions and narrower geometry for engagement, it enables precise chip placement even when contact pins are closely spaced for high pixel density integration
Solution Approach 2:
The positioning pin extends in the vertical dimension beyond the contact pins, creating an additional degree of freedom for alignment. The narrowing geometry of the positioning pin toward its tip provides a precise mechanical engagement feature that establishes alignment in the lateral dimensions, effectively decoupling the alignment function from the electrical contact function
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures reliable alignment and secure attachment of the semiconductor chip with high alignment tolerance, avoiding complex planarization processes and enabling reliable electrical connection, even with very small distances between contact pins, thus ensuring the mechanical stability and operational integrity of the electronic component.
Implementation Method 1
the solder material in the contact recesses is heated to a joining temperature at which the solder material melts at least partially... the contact pins are inserted into a contact recess and immersed in the molten solder material
Data Source
AI summary
The method of producing an electronic component (100) comprises a step A) of providing a semiconductor chip (2) having an underside (20), having a plurality of contact pins (21), and having at least one positioning pin (25) protruding from the underside. The contact pins are adapted to electrically contact the semiconductor chip. The positioning pin narrows in the direction away from the underside and protrudes further from the underside than the contact pins. The semiconductor chip is placed on the connection carrier, with the contact pins each being inserted into a contact recess and the positioning pin being inserted into the positioning recess. The contact pins are immersed in the molten solder material.