Chip-on-Chip Power Card With Embedded Thermal Conductor Cooling
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Solution Overview
Problem
Conventional power cards used in vehicles are bulky and inefficient for compact spaces, failing to effectively cool high-frequency switching power devices, which generates significant heat.
Innovation Solution
A compact chip-on-chip power card design featuring a dual-functional O lead frame with an embedded copper-graphite thermal conductor that enhances heat transfer and cooling by positioning the O lead frame between N and P lead frames, allowing for efficient heat dissipation from power devices to cold plates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional power card designs are used to cool power devices, then heat dissipation is achieved, but the device becomes bulky and occupies excessive space
Solution Approach 1:
The thermal conductor is embedded within the O lead frame, creating a nested structure where the thermal management component is integrated inside the existing structural element. This allows heat dissipation functionality to be achieved without adding external cooling components that would increase device volume.
Solution Approach 2:
The O lead frame is given a dual function: it serves as both an electrical conductor and a thermal conductor. By embedding the thermal conductor within the O lead frame, the patent merges structural, electrical, and thermal management functions into a single integrated component, eliminating the need for separate cooling structures.
2Temperature
If power devices are cooled using conventional designs, then thermal management is provided, but the device complexity increases
Solution Approach 1:
The O lead frame is designed to perform multiple functions simultaneously: electrical conduction, mechanical support, and thermal conduction. This multi-functionality reduces device complexity by eliminating the need for separate components dedicated to each function, while still achieving effective cooling.
Solution Approach 2:
The thermal conductor is nested within the O lead frame structure, allowing thermal management to be achieved through integration rather than addition of separate systems. This reduces overall device complexity while maintaining effective heat dissipation capabilities.
3Volume of moving object
If compact chip-on-chip design is used, then device size and inductance are reduced, but heat dissipation becomes more challenging
Solution Approach 1:
The thermal conductor is nested within the O lead frame, enabling effective heat dissipation pathways to be created within the compact chip-on-chip structure without requiring additional external cooling components that would compromise device compactness.
Solution Approach 2:
The patent uses a copper-graphite composite material for the thermal conductor, combining materials with high thermal conductivity to create an efficient heat dissipation pathway within the compact device structure. This composite material approach allows effective thermal management in a space-constrained environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly reduces size and inductance while effectively lowering the temperature of the power card, achieving better heat dissipation compared to conventional designs, with temperature reductions of up to 15 degrees Celsius in some embodiments.
Implementation Method 1
The O lead frame has, in part, an embedded copper-graphite thermal conductor... The O lead frame is configured to receive heat from the first power device and the second power device and transfer the heat for heat dissipation
Data Source
AI summary
A power card for use in a vehicle includes a N lead frame, a P lead frame, and an O lead frame. The O lead frame includes, in part, an embedded copper-graphite thermal conductor. Part of the O lead frame is located between the N lead frame and the P lead frame. A first power device is located on a first side of the O lead frame between the N lead frame and the O lead frame. A second power device being located on a second side of the O lead frame between the O lead frame and the P lead frame. The O lead frame is configured to receive heat from the first power device and the second power device and transfer the heat for heat dissipation.