Chip Power Supply Circuit Segmentation for Routing Density

Solution Overview

Problem

Existing chip power supply circuits are complex and dense, leading to poor heat dissipation and increased complexity in routing printed circuit boards, especially when used on limited-layer substrates like Aluminium.

Innovation Solution

The proposed chip power supply circuit design includes at least one chip with first and second power supply pins, where the first voltage regulator circuit is connected to the first power supply pin and the second voltage regulator circuit is connected between the first and second power supply pins, with both voltage regulator circuits located on different sides of the chip.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If elements of a chip power supply circuit are densely distributed to maximize space utilization, then the power supply conversion efficiency is improved, but the routing complexity of the printed circuit board increases and heat dissipation performance deteriorates

Engineering Contradiction:

Improvepower supply conversion efficiencyVSAvoidrouting complexity

Core Design Contradiction:

Loss of energyVSDevice complexity

Solution Approach 1:

The power supply circuit is divided into multiple independent voltage regulator modules, each handling specific voltage conversion tasks. This segmentation allows for distributed placement of components, reducing routing complexity while maintaining conversion efficiency through modular architecture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes multi-layer PCB routing to resolve the contradiction between dense component distribution and routing complexity. By transitioning from two-dimensional surface routing to three-dimensional multi-layer routing, complex power supply traces can be distributed across multiple layers, reducing surface congestion while maintaining efficient power delivery.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Loss of energy

If elements of a chip power supply circuit are densely distributed to maximize space utilization, then the power supply conversion efficiency is improved, but the heat dissipation performance deteriorates

Engineering Contradiction:

Improvepower supply conversion efficiencyVSAvoidheat dissipation performance

Core Design Contradiction:

Loss of energyVSTemperature

Solution Approach 1:

The power supply circuit is divided into multiple independent voltage regulator modules, each handling specific voltage conversion tasks. This segmentation allows for distributed placement of components, reducing routing complexity while maintaining conversion efficiency through modular architecture.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the PCB are assigned different thermal management characteristics. High-power voltage regulator components are placed in regions with enhanced heat dissipation capabilities, while low-power components are placed in standard regions. This local differentiation allows dense component distribution while maintaining heat dissipation performance through strategic thermal zone management.

Inventive Principle:

Principle #3Local quality

3Area of stationary object

If serpentine routing is used on Aluminium substrate to accommodate limited layers, then the routing space is optimized, but the routing complexity and manufacturing difficulty increase

Engineering Contradiction:

Improverouting space utilizationVSAvoidmanufacturing difficulty

Core Design Contradiction:

Area of stationary objectVSEase of manufacture

Solution Approach 1:

The power supply routing is segmented into multiple functional blocks, each with dedicated power and ground traces. This segmentation allows for systematic routing planning that reduces the need for complex serpentine patterns, as each block can be routed independently with simpler trace layouts.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent utilizes multi-layer PCB routing to resolve the contradiction between dense component distribution and routing complexity. By transitioning from two-dimensional surface routing to three-dimensional multi-layer routing, complex power supply traces can be distributed across multiple layers, reducing surface congestion while maintaining efficient power delivery.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS12242327B2Chip power supply circuit and electronic device

Publication Date: 2025.03.04 BEIJING BITMAIN TECHNOLOGIES

AI summary

A chip power supply circuit and an electronic device are provided. The chip power supply circuit includes: one or more chips each comprising a first power supply pin and a second power supply pin; a first voltage regulator circuit connected to the first power supply pin of a corresponding chip of the one or more chips; and a second voltage regulator circuit, where the first power supply pin of the corresponding chip of the one or more chips is connected to the second power supply pin of the corresponding chip via the second voltage regulator circuit, and the second voltage regulator circuit is configured to convert the first voltage into a second voltage. The first voltage regulator circuit and the second voltage regulator circuit are respectively located on different sides of at least one of the one or more chips.