Chip Power Supply System Via Inductor Module Placement
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Solution Overview
Problem
As 5G and AI technologies demand more powerful switching and computing capabilities, chips require larger currents, posing a challenge in efficiently providing the necessary power without causing energy consumption issues and overcurrent problems.
Innovation Solution
A chip power supply system that includes a printed circuit board (PCB) with vias connecting the chip to an inductor module, which is controlled by a power controller, reducing energy consumption and preventing overcurrents by shortening the power supply path and optimizing current distribution through capacitors and MOS transistors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the inductor module supplies power to the chip from the periphery of the chip through the PCB, then the power supply path is long causing high energy consumption, but the conventional power supply structure is simple to implement
Solution Approach 1:
The patent transitions from a conventional planar power supply approach to a three-dimensional structure by placing the inductor module directly beneath the chip and utilizing vertical vias for power transmission. This spatial reconfiguration shortens the power supply path from the periphery to the center, significantly reducing energy consumption while managing the increased structural complexity through precise via placement and layered PCB design.
2Reliability
If the inductor module transmits voltage to the chip through vias of different lengths, then the impedance to different power contacts varies causing overcurrents, but uniform via length increases manufacturing difficulty
Solution Approach 1:
The patent applies the equipotentiality principle by designing vias of uniform length that connect the inductor module to all power contacts of the chip. This ensures equal impedance to each power contact, preventing overcurrents and achieving uniform current distribution. The manufacturing complexity is managed by standardizing via dimensions across the PCB layout, making the uniform via design feasible through conventional fabrication processes.
3Productivity
If the chip requires larger currents for 5G and AI applications, then the signal processing and computing capabilities are improved, but the power supply system becomes more complex and energy consumption increases
Solution Approach 1:
The patent segments the power supply function by separating the inductor module from the chip, with the inductor positioned beneath the chip and connected through selective vias. This segmentation allows independent optimization of the power supply path, enabling efficient current delivery to support 5G and AI applications while minimizing energy loss through the shortened, dedicated power transmission path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively provides a stable and efficient power supply to the chip, reducing energy consumption and preventing damage from overcurrents, while also simplifying PCB design and reducing production costs.
Implementation Method 1
the inductor module transmits a voltage to the chip through the vias of the PCB
Implementation Method 2
the input capacitor is configured to filter an input voltage, and input the filtered input voltage into the inductor module; the output capacitor is configured to filter an output voltage, and input the filtered output voltage into the chip
Data Source
AI summary
This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.