Semiconductor Chip Protective Layer Release for Clean Carrier Separation
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices face inefficiencies and surface contamination issues during the temporary fixing and separation processes, particularly with the use of semiconductor chips and carriers.
Innovation Solution
A method involving a temporary fixing laminated body with a curable resin film and a carrier, where the curable resin film is irradiated with incoherent light to separate the carrier, reducing surface contamination and enhancing the manufacturing efficiency by using a protective layer to cover the semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional methods are used to separate the carrier from the semiconductor chip, then the manufacturing process can be completed, but soot occurs on the surface of the sealing portion causing contamination
Solution Approach 1:
A release film is introduced as an intermediary layer between the carrier and the sealing portion. This release film absorbs the harmful separation force during carrier removal, preventing direct contact between the separation mechanism and the sealing portion surface, thereby eliminating soot contamination while maintaining manufacturing efficiency
Solution Approach 2:
The conventional mechanical separation method that causes soot is replaced with a controlled release mechanism using the release film. The separation is achieved through the release film's designed adhesion properties rather than direct mechanical force, substituting a harsh mechanical process with a controlled material-based separation
2Ease of manufacture
If the semiconductor chip is temporarily fixed to the carrier for processing, then multiple steps can be performed efficiently, but the separation process causes surface contamination
Solution Approach 1:
The release film serves as a mediator that enables easy multi-step processing by providing a controlled temporary bond during fabrication, then allows clean separation without contaminating the sealing portion surface, thus maintaining both manufacturing ease and surface cleanliness
3Object-affected harmful factors
If incoherent light is used to separate the carrier, then soot occurrence is reduced, but the separation process requires specific light conditions
Solution Approach 1:
The release film acts as a light-interacting intermediary that absorbs or scatters the incoherent light energy, preventing direct light-induced soot formation on the sealing portion. This mediator approach reduces harmful effects while managing the complexity of light irradiation requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method efficiently manufactures semiconductor devices with reduced soot occurrence on the sealing portion, improving the reliability and stability of the semiconductor device by using a curable resin film with specific properties for adhesion and separation.
Implementation Method 1
The protective layer and the carrier are separated by irradiating the temporary fixing laminated body with incoherent light to remove the carrier from the temporary fixing laminated body
Implementation Method 2
The protective layer is a cured curable resin film
Data Source
AI summary
A method for manufacturing a semiconductor device including forming a temporary fixing laminated body including a carrier, and a sealing structure body provided on a main surface of the carrier and including a plurality of semiconductor chips and a sealing portion sealing the plurality of semiconductor chips, and removing the carrier from the temporary fixing laminated body. The semiconductor chip includes a chip main body including a first surface and a second surface, and a connection terminal provided on the first surface. The sealing portion includes an integrated protective layer adjacent to the carrier in the temporary fixing laminated body, covering the second surface. The protective layer is a cured curable resin film. The protective layer and the carrier are separated by irradiating the temporary fixing laminated body with incoherent light to remove the carrier from the temporary fixing laminated body.