Semiconductor Chip-Resin Interface Structure for Anti-Detachment
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Solution Overview
Problem
In semiconductor devices, poor adhesion between the molding resin and the semiconductor element can lead to detachment of the resin from the chip, posing a challenge during manufacturing and processing.
Innovation Solution
The semiconductor device incorporates a configuration with recesses and protrusions at the interface between the first semiconductor chip and the sealing resin, enhancing adhesion by creating a bonding plane with recess surfaces and protruding portions within the sealing resin, which are designed to securely adhere and prevent detachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat interface between the semiconductor chip and molding resin is used, then the manufacturing process is simple, but the adhesion between resin and chip is poor causing detachment
Solution Approach 1:
The patent applies curvature by forming recesses and protrusions at the interface between the semiconductor chip and molding resin. The recesses create curved surfaces that increase the contact area and mechanical interlocking between the resin and chip, preventing resin detachment while maintaining manufacturing feasibility through standard molding processes.
2Reliability
If the molding resin is applied to seal the semiconductor element, then the chip is protected, but the resin may detach due to poor adhesion during dicing and processing
Solution Approach 1:
The patent implements preliminary action by pre-forming recesses and protrusions at the chip-resin interface before the molding resin is applied. This preliminary structural preparation ensures that when the resin is molded, it naturally fills the recesses and forms strong mechanical interlocking, achieving reliable adhesion without requiring additional post-processing steps or complex manufacturing procedures.
Data Source
AI summary
A semiconductor device including a first semiconductor chip that has a first surface including a first region and a second region adjacent to the first region; a second semiconductor chip provided on the first region; and resin provided on the second region and adjoining the second semiconductor chip, wherein at least a part of an interface between the first semiconductor chip and the resin has recesses and protrusions.