Chip Resistor Aggregate Punching for Reel-Free Manufacturing
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Solution Overview
Problem
Conventional methods for manufacturing chip resistors are inefficient and require complex reel-based processes, leading to production line stoppages and handling challenges.
Innovation Solution
A method involving the use of conductive and resistive elongated boards bonded together using high energy beam welding, followed by punching to form chip resistors, eliminating the need for reels and simplifying handling, with the option to bend conductive boards for enhanced manufacturing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If reel-based processes are used to manufacture chip resistors, then continuous production is possible, but the process becomes complex and requires frequent reel changes causing production line stoppages
Solution Approach 1:
The invention extracts and eliminates the reel-based process from the manufacturing system. Instead of using reels to hold and feed resistive and conductive material strips, the patent uses flat elongated boards that can be directly positioned and bonded, removing the complex reel handling mechanism entirely and simplifying the overall process
Solution Approach 2:
The invention merges the resistive material board and conductive material boards into a single bonded assembly called a resistor aggregate. This integration allows multiple materials to be joined together in one operation, eliminating the need for separate reel-based feeding and assembly processes
2Ease of operation
If reel-based processes are used, then material feeding is continuous, but handling becomes difficult and production lines stop for reel changes
Solution Approach 1:
The invention uses flat elongated boards instead of reusable reels. These boards are simpler, easier to handle, and can be processed more quickly. The boards are consumed in the bonding process to create the resistor aggregate, eliminating the need for complex reel changes and reducing downtime
Solution Approach 2:
The resistive and conductive materials are prepared as flat elongated boards in advance, with their positions and orientations predetermined. This preliminary preparation allows for quick positioning and bonding without the need for complex reel feeding mechanisms, improving both handling ease and reducing setup time
3Manufacturing precision
If conventional cutting methods are used on bonded strips, then chip resistors are produced, but dimensional accuracy may be compromised
Solution Approach 1:
The invention replaces conventional mechanical cutting methods with punching. The resistor aggregate is punched into individual chip resistors using a punching die, which provides cleaner cuts and better dimensional accuracy compared to traditional cutting methods, while maintaining high production speed through the efficiency of the punching process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach increases manufacturing efficiency by eliminating reel-based processes, reducing production line stoppages, and improving handling, while ensuring precise dimensional accuracy and resistance values in the chip resistors.
Implementation Method 1
forming a resistor aggregate by bonding the resistive member to the at least three conductive elongated boards... the step of forming a resistor aggregate uses high energy beam welding
Data Source
AI summary
[Object]A method for efficiently manufacturing chip resistors is provided.[Means]The method includes the steps of preparing at least three conductive elongated boards 711 made of an electrically conductive material and a resistive member 702 made of a resistive material, arranging the at least three conductive elongated boards 711 apart from each other along a width direction crossing a longitudinal direction in which one of the at least three conductive elongated boards 711 is elongated, forming a resistor aggregate 703 by bonding the resistive member 702 to the at least three conductive elongated boards 711, and collectively dividing the resistor aggregate 703 into a plurality of chip resistors by punching so that each of the chip resistors includes two electrodes and a resistor portion bonded to the two electrodes.