Chip Resistor Bent Electrode Connection
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Solution Overview
Problem
The connection reliability between front electrodes and end-surface electrodes in chip resistors deteriorates when the size of the external shape is reduced, especially when the front electrodes have a very thin thickness, leading to unreliable connections in chip resistors with wide and flat end-surface electrodes.
Innovation Solution
The chip resistor design includes bent portions on the front electrodes that extend around from between the insulating substrate and the protection layer, allowing the end-surface electrodes to connect to exposed portions of the front electrodes, enhancing connection reliability while maintaining wide and flat end-surface electrodes. The manufacturing method involves forming primary and secondary division grooves in a large-sized substrate, rubbing the front electrodes to create bent portions, and forming end-surface electrodes on the division surfaces to connect with the exposed portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the chip resistor is reduced, then the miniaturization of electronic devices is achieved, but the connection reliability between front electrodes and end-surface electrodes deteriorates
Solution Approach 1:
The front electrode is extended from the front surface into the protection layer along the depth dimension, creating a bent portion that provides additional connection area. This dimensional extension compensates for the reduced electrode thickness in miniaturized resistors, maintaining connection reliability while achieving size reduction.
Solution Approach 2:
The front electrode is pre-formed with a bent portion that extends into the protection layer before the end-surface electrode is applied. This preliminary structuring ensures that when the end-surface electrode is formed, it has adequate connection area to the front electrode, preventing connection reliability issues in miniaturized devices.
2Length of moving object
If the thickness of the front electrode is reduced, then the chip resistor size is minimized, but the connection reliability between front electrodes and end-surface electrodes deteriorates excessively
Solution Approach 1:
When the front electrode thickness is reduced for miniaturization, the electrode is extended in the depth dimension by forming a bent portion that penetrates into the protection layer. This compensates for the reduced thickness by providing additional connection area along the depth direction, maintaining adequate connection reliability.
Solution Approach 2:
The bent portion of the front electrode is nested within the protection layer, allowing the electrode to extend into the insulating material without increasing the overall external dimensions of the chip resistor. This nested configuration provides extended connection area while maintaining compact size.
3Area of stationary object
If the end-surface electrodes are formed to extend around to a flattened upper surface of the protection layer, then wide and flat terminal electrodes are achieved, but the end-surface electrodes can be connected only to the front electrodes exposed between insulating substrate and protection layer
Solution Approach 1:
The connection path is extended from the limited exposed portion on the front surface into the depth dimension by forming the bent portion of the front electrode that penetrates the protection layer. This allows the end-surface electrode to connect to both the exposed front surface portion and the extended bent portion, significantly increasing the connection area and reliability.
Solution Approach 2:
The bent portion of the front electrode acts as an intermediary structure that bridges the connection between the end-surface electrode and the main body of the front electrode. It provides an extended interface area that enhances the electrical and mechanical connection while allowing the end-surface electrode to maintain its wide and flat configuration.
Data Source
AI summary
Provided is a chip resistor having wide and flat end-face electrodes on a surface thereof and having increased connection reliability between upper electrodes and the end-face electrodes. The chip resistor according to the present invention is provided with: a cuboidal insulating substrate 1; a pair of upper electrodes 2 disposed at both ends in a longitudinal direction on a surface of the insulating substrate 1; a resistor body 3 disposed between the upper electrodes 2; an insulating protective layer 4 covering the entire surfaces of the upper electrodes 2 and the resistor body 3; and a pair of end-face electrodes 5 disposed on both end faces in the longitudinal direction of the insulating substrate 1, wherein the upper electrodes 2 include bent portions 2a extending around from between the insulating substrate 1 and the protective layer 4 along the end faces of the protective layer 4, and the end-face electrodes 5 are connected to the exposed portions of the upper electrodes 2, including the bent portions 2a, exposed from between the insulating substrate 1 and the protective layer 4.