Chip Resistor with Cap-Shaped End Face Electrodes for Reliable Miniaturization
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Solution Overview
Problem
The downsizing of chip resistors leads to reduced contact areas between front electrodes and end face electrodes, resulting in decreased connection reliability.
Innovation Solution
A chip component design featuring a strip-shaped conductive film on the insulating substrate with triangular cross-sectional electrodes and cap-shaped end face electrodes, covered by a glass and resin coating layer, allowing for reliable connection even at reduced dimensions and enabling resistance value adjustment through laser trimming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the outer dimension of the chip resistor is reduced to achieve downsizing, then the size of the chip component is reduced, but the contact areas between the front electrodes and the end face electrodes are significantly reduced, causing connection reliability to decrease
Solution Approach 1:
The end face electrodes are formed in a cap shape that extends in the thickness direction (vertical dimension) of the insulating substrate. This dimensional extension increases the contact area between the end face electrodes and both the front electrodes and the conductive film, thereby maintaining connection reliability even when the planar dimensions of the chip resistor are reduced for downsizing.
Solution Approach 2:
The chip resistor employs a multi-layer composite structure including the insulating substrate, conductive film, electrodes, and cap-shaped end face electrodes. This composite design allows the end face electrodes to effectively bridge the front electrodes and conductive film through multiple contact points, ensuring reliable electrical connection in miniaturized configurations.
2Volume of moving object
If the contact areas between front electrodes and end face electrodes are reduced due to downsizing, then the chip component becomes smaller, but the connection reliability of the end face electrodes with respect to the resistor and front electrodes decreases
Solution Approach 1:
By extending the end face electrodes in the thickness direction to form cap shapes, the invention increases the contact area and connection strength between the end face electrodes and the front electrodes/conductive film, compensating for the reduced contact areas caused by downsizing.
Solution Approach 2:
The cap-shaped end face electrodes are formed to cover and connect multiple components (front electrodes and conductive film) simultaneously, creating a nested connection structure that enhances connection strength despite reduced overall chip size.
Data Source
AI summary
A chip resistor including: a rectangular parallelepiped insulating substrate; a strip-shaped resistor; a pair of front electrodes formed on a front surface of the resistor at both ends in the longitudinal direction; an insulating protective layer; and a pair of end face electrodes formed at both ends of the insulating substrate in the longitudinal direction, each of which is connected to each end face of the resistor, corresponding one of the front electrodes, and protective film; and a pair of external electrodes, wherein a cross-sectional shape of each of the front electrodes is almost a triangle in which a side of the end face has a maximum height, and a shape of an end face of each of the end face electrodes is almost a square.