Rectangular Plate Chip Resistor Electroplating Method
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Solution Overview
Problem
Existing methods for manufacturing rectangular plate type chip resistors are complex and costly, with inadequate electrode adhesion and reliability, particularly at low resistance values, due to the need for multiple cutting steps and slits or slots for resistance adjustment.
Innovation Solution
A method involving a resistive alloy plate strip with an insulating protective film and integrated electrode layers formed by electroplating, where the resistance is controlled by adjusting the alloy plate thickness, protective film width, and cutting length, eliminating the need for slits or slots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple cutting steps and slits or slots are used to adjust resistance, then resistance control is achieved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent extracts the resistance adjustment function from the electrode structure itself and transfers it to the alloy plate strip dimensions (thickness and length). By removing the need for slits or slots in the electrodes, the manufacturing process is simplified while resistance control is maintained through precise control of the alloy plate strip parameters before electroplating.
Solution Approach 2:
The resistance value is predetermined by selecting alloy plate strips with specific thicknesses and lengths before the electroplating process. This preliminary determination of resistance parameters eliminates the need for subsequent complex electrode modifications, allowing the electroplating process to focus solely on forming uniform electrode layers.
2Manufacturing precision
If multiple cutting steps are performed, then resistance adjustment is possible, but production time and cost increase
Solution Approach 1:
The patent removes the requirement for multiple cutting steps by extracting the resistance adjustment function to the alloy plate strip selection stage. Only a single transverse cutting step is needed to separate individual chip resistors, while resistance variation is achieved by using alloy plate strips of different thicknesses and lengths from the outset.
Solution Approach 2:
The patent changes the approach from modifying electrode geometry (slits, slots, multiple cuts) to varying the fundamental dimensions of the alloy plate strip (thickness and length). This parameter change simplifies the manufacturing process to a single cutting step while maintaining the ability to produce different resistance values.
3Ease of manufacture
If end electrodes are formed after the first cutting step, then electrode formation is possible, but adhesion and reliability deteriorate
Solution Approach 1:
The patent merges the formation of all electrode layers (surface electrodes, back electrodes, and end electrodes) into a single electroplating step performed on the alloy plate strip before cutting. This unified approach ensures that all electrodes are formed under identical conditions with uniform thickness and material composition, maximizing adhesion and reliability.
Solution Approach 2:
The electroplating process is performed preliminarily on the complete alloy plate strip structure before any cutting operations. This ensures that all electrode layers are firmly attached to the substrate in their final positions, and subsequent cutting simply separates the chip resistors without compromising electrode integrity or adhesion.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables easy, low-cost, and efficient manufacture of rectangular plate type chip resistors with reliable electrode structures and controlled resistance, particularly in the range of 0.5 to 30 mΩ, ensuring uniform electrode thickness and improved adhesion.
Implementation Method 1
forming an electrode layer composed of integrated surface, back, and end electrodes, along both sides of the protective film by electroplating
Data Source
AI summary
A method for manufacturing rectangular plate type chip resistors and a rectangular plate type chip resistor obtained by this method. The method includes the steps of (A) providing a resistive alloy plate strip of predetermined width and thickness, (B) forming an insulating protective film of a predetermined width longitudinally along the middle of upper and lower faces of the alloy plate strip, (C) forming an electrode layer composed of integrated surface, back, and end electrodes, along both sides of the protective film by electroplating, and (D) cutting the alloy plate strip coated with the protective films and the electrode layers in step (C) transversely in predetermined lengths, wherein resistance is controlled to be within a predetermined range by adjusting the thickness of the alloy plate strip in step (A), the width of the protective film formed in step (B), and the cutting length in step (D).