Chip Resistor Groove-Based Conductor Formation

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Solution Overview

Problem

The precise rearrangement of thin bar members in chip resistor manufacturing is challenging, leading to imprecise formation of electrode layers and hindered yield enhancement.

Innovation Solution

A method involving the formation of grooves on the substrate surface, allowing conductor layers to be formed directly on the side surfaces, eliminating the need for substrate section separation and rearrangement, thereby maintaining precise positional relationships during the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If chip resistors are reduced in size, then miniaturization is achieved, but the bar members become thin requiring highly precise rearrangement techniques

Engineering Contradiction:
Improvechip resistor sizeVSAvoidrearrangement precision
Core Design Contradiction:
Volume of moving objectVSManufacturing precision

Solution Approach 1:

The conductor layer is formed in advance within the grooves on the substrate surface before the substrate sections are separated. This preliminary formation of conductor layers ensures that when substrate sections are later separated and positioned, the conductor layers are already in place and will maintain proper electrical connections without requiring precise manual rearrangement of thin bar members.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The substrate is divided into multiple substrate sections by forming grooves that define the boundaries between sections. This segmentation allows each section to be processed independently while maintaining the overall structure, and the conductor layers formed in the grooves bridge between sections to maintain electrical continuity after separation.

Inventive Principle:
Principle #1Segmentation

2Ease of manufacture

If bar members are separated and rearranged for conductor layer formation, then electrode layers can be formed, but positional precision is lost and yield is hindered

Engineering Contradiction:
Improveconductor layer formationVSAvoidelectrode layer position
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

Conductor layers are formed in the grooves before substrate section separation. This preliminary action ensures that the conductor layers are already positioned correctly and will maintain proper alignment with electrode layers on adjacent substrate sections, eliminating the need for precise manual rearrangement and improving both ease of manufacture and positional precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The grooves act as intermediaries that hold and position the conductor layers. By forming conductor layers within these predefined grooves, the system maintains precise positioning without requiring direct manual placement, as the grooves serve as guiding structures that ensure proper alignment during substrate section assembly.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Length of moving object

If thin bar members are used for small chip resistors, then miniaturization is achieved, but highly precise rearrangement techniques are required

Engineering Contradiction:
Improvebar member thicknessVSAvoidrearrangement technique complexity
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

Conductor layers are formed in the grooves on the substrate surface before the substrate is cut into thin bar members. This preliminary formation simplifies the subsequent handling of thin bar members, as the conductor layers are already in place and will automatically align when bar members are assembled, reducing the complexity of rearrangement techniques required.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The conductor layers are formed in the vertical dimension within the grooves on the substrate surface, rather than requiring precise horizontal placement of thin bar members. This dimensional approach allows thin bar members to be handled more easily, as the conductor layers are embedded in the substrate structure and will maintain proper positioning through the groove geometry rather than requiring complex external alignment techniques.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS9520215B2Chip resistor and method of manufacturing the same
Publication Date: 2016.12.13 ROHM CO LTD
  • US9520215B2 patent drawing
  • US9520215B2 patent drawing
  • US9520215B2 patent drawing

AI summary

A method of manufacturing a chip resistor includes the following steps. A resistor layer is formed on an obverse surface of a material substrate. A plurality of substrate sections are defined in the material substrate by forming, in the obverse surface of the material substrate, a plurality of first grooves each of which is elongated in a first direction. A conductor layer is formed in each of the first grooves. The substrate sections are cut along lines extending in a second direction different from the first direction.