Chip Resistor Groove Cutting for Resistance Precision

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Solution Overview

Problem

The existing methods for manufacturing chip resistors face challenges in achieving precise resistance values, leading to lower productivity due to the need for fine adjustments and the requirement of designing and inventorying multiple types of resistance films to accommodate a wide range of resistance values, which complicates the production process.

Innovation Solution

A method involving a cutting device that adjusts the resistance film width by forming grooves on the chip resistance substrate before severing it into discrete resistors, allowing for flexible control of resistance values by varying the groove width, thereby eliminating the need for multiple resistance film designs and adjustments.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If laser beam irradiation is used to adjust resistance values after substrate division, then resistance precision is improved, but productivity deteriorates

Engineering Contradiction:
Improveresistance precisionVSAvoidproductivity
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies preliminary action by forming grooves to adjust resistance film width before the substrate is divided into individual resistors. This allows resistance values to be pre-adjusted on the entire substrate in one operation, eliminating the need for subsequent laser beam irradiation on each individual resistor, thereby maintaining precision while significantly improving productivity

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If multiple types of resistance films are designed and inventoried to cover wide resistance range, then resistance value coverage is improved, but device complexity deteriorates

Engineering Contradiction:
Improveresistance value coverageVSAvoiddevice complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent applies parameter changes by using a single resistance film type and adjusting its effective width through groove formation to achieve different resistance values. By changing the geometric parameter (width) rather than using different material compositions, the system can cover a wide resistance range with a single film design, reducing the complexity of managing multiple film types and their inventories

Inventive Principle:
Principle #35Parameter changes

3Adaptability or versatility

If multiple types of resistance films are designed and inventoried to cover wide resistance range, then resistance value coverage is improved, but productivity deteriorates

Engineering Contradiction:
Improveresistance value coverageVSAvoidproductivity
Core Design Contradiction:
Adaptability or versatilityVSProductivity

Solution Approach 1:

The patent applies universality by making a single resistance film type serve multiple functions - it can produce resistors with different resistance values by varying the groove width. This multi-functional approach eliminates the need to design, manufacture, and inventory multiple specialized resistance films, thereby improving productivity while maintaining wide resistance value coverage

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly increases productivity by enabling the production of multiple types of chip resistors from a single substrate, simplifying the manufacturing process and reducing inventory needs, while ensuring compliance with standard resistor sizes without additional adjustments.

Implementation Method 1

a groove forming unit (13) containing a cutting blade (131) which has a predetermined width and cuts the workpiece (1) held by the chuck table (11)

Methodology Applied
Scientific EffectMechanical cutting: Abrasion

Data Source

PatentUS7305754B2Method of manufacturing chip resistor
Publication Date: 2007.12.11 DISCO CORP
  • US7305754B2 patent drawing
  • US7305754B2 patent drawing
  • US7305754B2 patent drawing

AI summary

In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film including at least second prescribed severing lines. After forming the grooves, the chip resistance substrate is severed in longitudinal and lateral directions along first prescribed severing lines for dividing the conductive strips into two parts and the second prescribed severing lines perpendicular to the first prescribed severing lines so as to produce discrete chip resistors.