Chip Resistor Structure for Heat Dissipation Without Resistance Shift
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Solution Overview
Problem
The resistance value of shunt resistors is affected by changes in electrode area, which impacts heat radiation performance, and existing solutions fail to improve heat radiation independently of the resistance value.
Innovation Solution
A chip resistor design with conductive underlying layers and electrodes having varying electrical resistivities, where the underlying layers' resistivities are higher than the resistive element and electrode layers, allowing for improved heat radiation without altering the resistance value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the area of the first electrode and the second electrode is increased to improve heat radiation performance, then the heat radiation performance is improved, but the interval between the first electrode and the second electrode decreases and the resistance value of the shunt resistor is varied from a designed resistance value
Solution Approach 1:
The patent introduces conductive underlying layers that are segmented and positioned between the electrodes and the resistive element. These underlying layers extend in the longitudinal direction and have conductive films formed on them, creating a distributed heat radiation structure that does not require increasing the electrode area, thus maintaining the electrode interval and designed resistance value while improving heat radiation performance.
Solution Approach 2:
The patent extends the heat radiation function from the electrode plane to the longitudinal dimension by introducing conductive underlying layers that extend along the longitudinal direction of the resistive element. This dimensional extension allows heat radiation without increasing the electrode area, thereby maintaining the designed resistance value.
2Temperature
If the area of the first electrode and the second electrode is increased to improve heat radiation performance, then the heat radiation performance is improved, but the structure becomes more complex
Solution Approach 1:
The patent merges the heat radiation function with the existing electrode structure by forming conductive films on conductive underlying layers that are integrated into the resistor body. This merging approach enables heat radiation without adding separate complex structures, as the underlying layers are formed using the same conductive film deposition processes as the electrodes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The chip resistor achieves enhanced heat radiation performance independently of its resistance value, facilitating efficient heat dissipation and simplifying circuit board design while maintaining consistent resistance.
Implementation Method 1
A first electrical resistivity of the first conductive underlying layer is higher than a second electrical resistivity of the first electrode layer and higher than a third electrical resistivity of the resistive element. A fourth electrical resistivity of the second conductive underlying layer is higher than a fifth electrical resistivity of the second electrode layer and higher than the third electrical resistivity of the resistive element.
Data Source
AI summary
A chip resistor includes a resistive element, a first conductive underlying layer, a second conductive underlying layer, a first electrode, and a second electrode. The first electrode includes a first electrode layer. The second electrode includes a second electrode layer. A first electrical resistivity of the first conductive underlying layer is higher than a second electrical resistivity of the first electrode layer and higher than a third electrical resistivity of the resistive element. A fourth electrical resistivity of the second conductive underlying layer is higher than a fifth electrical resistivity of the second electrode layer and higher than the third electrical resistivity of the resistive element.