Chip Resistor Layout With Split Resistive Elements for Heat Dissipation
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Solution Overview
Problem
The existing chip resistor designs experience excessive temperature at the center and have insufficient short time overload (STOL) characteristics due to the single resistive element being covered by an insulating protective film, leading to inadequate heat dissipation.
Innovation Solution
The chip resistor incorporates two resistive elements and an intermediate electrode on an insulating substrate, with one resistive element closer to one side surface and the other closer to the opposite side surface, along with electroconductive resin layers for enhanced heat dissipation, and trimming grooves for precise resistance setting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single resistive element is provided at the center of the insulating substrate and covered with an insulating protective film, then the structure is simple and easy to manufacture, but the temperature at the center excessively increases and short time overload characteristics are insufficient
Solution Approach 1:
The single resistive element at the center is divided into multiple resistive elements (first, second, third, and fourth resistive elements) arranged in a matrix pattern. This segmentation distributes the heat generation across multiple elements rather than concentrating it at the center, thereby reducing the peak temperature while maintaining the overall resistance function.
Solution Approach 2:
The resistive elements are arranged asymmetrically with different lengths in the first direction (first length L1 for outer elements, second length L2 for inner elements) while maintaining equal lengths in the second direction. This asymmetric design allows optimization of current distribution and heat dissipation pathways, preventing excessive temperature concentration.
2Device complexity
If a single resistive element is covered with an insulating protective film, then the structure is compact, but heat dissipation is insufficient and short time overload characteristics are poor
Solution Approach 1:
The resistive elements are arranged in a two-dimensional matrix pattern (multiple rows and columns) rather than a single central element. This dimensional expansion increases the surface area available for heat dissipation to the surrounding environment, improving thermal management while maintaining a compact overall device footprint.
Solution Approach 2:
Different resistive elements have different lengths in the first direction (L1 vs L2), creating local variations in resistance and current density. This allows certain elements to bear more load while others provide heat dissipation pathways, optimizing the balance between electrical function and thermal management.
3Temperature
If multiple resistive elements with different lengths are provided, then heat dissipation is improved, but the manufacturing precision requirements increase due to trimming grooves
Solution Approach 1:
Trimming grooves are pre-formed in the resistive elements during the manufacturing process using laser irradiation. This preliminary action allows for precise control of the final resistance values by removing specific portions of the resistive material, enabling accurate resistance setting while maintaining the beneficial multi-element heat dissipation structure.
Solution Approach 2:
The traditional mechanical trimming method is replaced with laser irradiation to form trimming grooves. This substitution provides higher precision and better control over the resistance value adjustment, as the laser can precisely remove material without mechanical contact, reducing variability and improving manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation and short time overload characteristics by allowing quicker radiation of heat to the outside, reducing temperature increases and enhancing the accuracy of resistance value setting.
Implementation Method 1
allows quicker radiation of heat to the outside
Implementation Method 2
first trimming groove provided in the first resistive element; second trimming groove provided in the second resistive element
Data Source
AI summary
A chip resistor includes an insulating substrate, a first electrode, a second electrode, a first resistive element, a second resistive element, and an intermediate electrode. A first length of the first resistive element in a first direction in which the first resistive element and the second resistive element are separated from each other is longer than a second length of the second resistive element in the first direction. The first resistive element is provided with a first trimming groove. The second resistive element is provided with a second trimming groove.