Chip Resistor Offset Auxiliary Electrode Laser Alignment
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Solution Overview
Problem
Conventional chip resistors require extremely high positional accuracy for laser beam application to connect the upper plating portion to an external conductor, making it difficult to establish a reliable connection without precise alignment.
Innovation Solution
A chip resistor design featuring offset auxiliary electrodes and plating electrodes that allow for connection to an external conductive layer without the need for precise laser beam application, with the auxiliary electrodes and plating electrodes extending beyond the principal surface electrodes to increase the connection area and reduce the risk of damage from misalignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If laser beam is applied to connect upper plating portion to external conductor, then electrical connection is established, but extremely high positional accuracy is required making the process difficult
Solution Approach 1:
The patent extends the upper plating portion in the vertical dimension (thickness direction) to create a protruding structure. This dimensional extension transforms the connection interface from a planar two-dimensional contact to a three-dimensional protruding contact, allowing laser beams to connect to the external conductor through the insulating resin layer with relaxed positional accuracy requirements.
Solution Approach 2:
The upper plating portion is formed to protrude through the insulating resin layer in advance during the chip resistor manufacturing process. This preliminary action prepares the connection interface beforehand, so that during subsequent mounting and plating processes, the laser beam only needs to connect to the already-positioned protruding plating portion without requiring extremely high positional accuracy.
2Measurement precision
If laser beam application with high positional accuracy is required, then precise connection can be achieved, but the process becomes complex and difficult to implement
Solution Approach 1:
By extending the upper plating portion vertically through the insulating resin layer, the patent creates a three-dimensional connection interface that is more tolerant to positional variations. This dimensional change simplifies the mounting and plating processes by eliminating the need for extremely precise laser beam positioning, thereby reducing process complexity.
3Ease of manufacture
If conventional chip resistor structure is used, then manufacturing is simple, but connection to external conductor requires extremely precise laser beam application
Solution Approach 1:
The upper plating portion is formed to protrude through the insulating resin layer during the chip resistor manufacturing process itself. This preliminary action integrates the connection structure preparation into the manufacturing process, maintaining manufacturing simplicity while eliminating the need for extremely precise laser beam positioning during subsequent mounting and plating processes.
Data Source
AI summary
[Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base 1, a first principal surface electrode 21, a second principal surface electrode spaced apart from the first principal surface electrode 21 in a first direction X1, a resistor element 4 in contact with the first principal surface electrode 21 and the second principal surface electrode 31, an overcoat 6 covering the resistor element 4, the first principal surface electrode 21 and the second principal surface electrode, a first auxiliary electrode 25 covering the first principal surface electrode 21 and the overcoat 6, and a first plating electrode 27 covering the first auxiliary electrode 25. The first auxiliary electrode 25 includes a portion 259 offset from the first principal surface electrode 21 in the first direction X1.