Chip Resistor Recessed Electrode Structure for Stronger Bonding
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Solution Overview
Problem
Conventional chip resistors face challenges in reducing size and ensuring reliable bonding between electrodes and the resistor body, leading to potential poor connections and increased size of electronic devices.
Innovation Solution
The chip resistor design features a resistor body with a recessed second main surface between the first and second electrode layers, allowing for smaller size and improved bonding by connecting the electrodes to the second main surface, which enhances the bonding area and reduces the risk of short-circuits, using metal-bonded junctions and a specific manufacturing process that includes forming a recess and adjusting the electric resistance value.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrodes are connected to the end surfaces of the resistor body without a recess, then the structure is simpler, but the bonding area is reduced and connection reliability deteriorates
Solution Approach 1:
The invention transitions from a planar connection (electrode on end surface) to a three-dimensional connection by forming a recess in the end surface. This allows the electrode to be embedded in the recess, increasing the bonding area from a simple surface contact to a multi-faceted interface including the bottom and side walls of the recess, thereby improving connection reliability without excessive structural complexity.
2Volume of moving object
If the chip resistor size is reduced, then the electronic device size is reduced, but the bonding area between electrode and resistor body is reduced leading to poor connections
Solution Approach 1:
The invention applies local quality by creating a recess specifically at the electrode connection region rather than uniformly increasing the entire chip resistor size. This localized structural modification concentrates the bonding area enhancement where it is most needed (at the electrode-resistor body interface) while keeping the overall chip dimensions small, thus maintaining both compact size and strong bonding.
3Reliability
If a recess is formed in the resistor body to improve bonding, then the bonding area increases, but the manufacturing process becomes more complex
Solution Approach 1:
The recess is formed in the resistor body before the electrode is attached to it. This preliminary action allows the recess geometry to be precisely controlled during the resistor body fabrication process, and subsequently provides a pre-prepared bonding interface that simplifies the electrode attachment step. The electrode can be directly mounted into the pre-formed recess without requiring additional complex processing steps.
Data Source
AI summary
The chip resistor includes a first electrode layer, a second electrode layer, and a resistor body. The resistor body includes a first main surface, a second main surface, a first side surface, and a second side surface. The first electrode layer is connected to the first end of the second main surface on the side of the first side surface. The second electrode layer is connected to the second end of the second main surface on the side of the second side surface. The second electrode layer is spaced apart from the first electrode layer by a first interval. In a plan view viewed from a direction perpendicular to the first main surface, the protruding length of the first electrode layer from the first side surface is 0 mm or more and equal to or less than 0.5 times the first interval.