Chip Resistor Rough Surface Insulating Layer Corrosion
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Solution Overview
Problem
The dense structure of the second protective layer in chip resistors compromises the tight contact properties of end surface electrodes and plating layers, leading to degraded corrosion resistance and risk of peeling off, especially when exposed to corrosive gases.
Innovation Solution
The chip resistor design includes a second insulating layer with rough surface portions formed by blast treatment or auxiliary insulating layers, ensuring tight contact between end surface electrodes, plating layers, and the second insulating layer, enhancing corrosion resistance by extending the end surface electrodes and plating layers beyond the boundary positions to the rough surface portions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the second protective layer is formed smooth and dense, then humidity resistance is improved, but peeling resistance is degraded
Solution Approach 1:
The second protective layer combines a smooth dense central portion for humidity resistance with rough peripheral portions that provide mechanical interlocking with electrodes, thereby maintaining both humidity resistance and peeling resistance without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures excellent corrosion resistance and humidity protection for the resistive element by maintaining tight contact properties between the end surface electrodes, plating layers, and the second insulating layer, preventing peeling and corrosion issues.
Implementation Method 1
rough surface portions made rougher in surface roughness than any other portion of the second insulating layer are provided at opposite end portions of the second insulating layer
Data Source
AI summary
To provide a chip resistor in which a resistive element can be surely protected from an external environment and which is also excellent in corrosion resistance, a chip resistor 1 is configured to include an insulating substrate 2, a pair of front electrode 3 provided on opposite end portions of a front surface of the insulating substrate 2, a pair of back electrodes 7 provided on opposite end portions of a back surface of the insulating substrate 2, a resistive element 4 provided to extend onto the two front electrodes 3, a first insulating layer 5 covering the resistive element 4, a second insulating layer 6 made of a resin material to cover the first insulating layer 5, end surface electrodes 8 establishing electrical continuity between the front electrodes 3 and the back electrodes 7, plating layers 9 covering the end surface electrodes 8, etc. Rough surface portions 6a made rougher in surface roughness than any other portion of the second insulating layer 6 are formed at opposite end portions of the second insulating layer 6. End portions of the end surface electrodes 8 and the plating layers 9 are brought into tight contact with the rough surface portions 6a respectively.