Chip Resistor Segmentation and Fuse Trimming for Resistance Accuracy
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Solution Overview
Problem
Existing chip resistors face challenges in achieving a wide range of resistance values due to the limited area of the resistive film, leading to difficulties in producing higher resistance values and susceptibility to mounting errors, which also affects the accuracy and reliability of chip capacitors, inductors, and diodes.
Innovation Solution
The development of a chip component with an aluminum-containing interconnection film that connects functional elements like resistors, capacitors, and inductors to electrodes via fuses, allowing for precise adjustment of characteristic values by disconnecting specific fuses and using a semiconductor device production method for accurate and reliable production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the area of the resistive film is increased to achieve higher resistance values, then the resistance range is improved, but the chip size increases making it susceptible to transportation error and mounting trouble
Solution Approach 1:
The resistive film is divided into multiple resistor elements (first, second, third resistor elements) with different resistance values. By selectively connecting these segmented elements in series or parallel configurations, a wide range of resistance values can be achieved without increasing the overall chip area, thus maintaining small size while improving resistance accuracy.
Solution Approach 2:
The patent employs laser trimming to dynamically adjust the resistance value after fabrication. By selectively removing portions of the resistive film or adding conductive material, the resistance can be precisely tuned to target values. This dynamic adjustment capability allows achieving accurate resistance values without requiring larger film areas during the design phase.
2Manufacturing precision
If laser trimming is used to adjust resistance to target value, then resistance accuracy is improved, but the chip cannot be adapted for a wide range of resistance values
Solution Approach 1:
The resistive film is segmented into multiple resistor elements with different base resistance values. This segmentation allows the chip to provide a wide range of resistance values by selectively connecting different elements, while laser trimming can still be applied to each element for precise adjustment to target values, thus achieving both wide adaptability and high precision.
Solution Approach 2:
The chip design incorporates multiple resistor elements that can be configured in different ways (series, parallel, or individually selected) to serve multiple resistance value requirements. This multi-functional approach allows a single chip to adapt to a wide range of resistance applications while maintaining the ability to achieve precise target values through laser trimming.
3Productivity
If the chip size is reduced for miniaturization, then productivity and integration are improved, but the area of the resistive film is limited making it difficult to achieve higher resistance values
Solution Approach 1:
By segmenting the resistive film into multiple small resistor elements, the patent achieves high resistance values without requiring a large overall film area. The segmented elements can be efficiently arranged in a compact layout, maintaining small chip size while providing sufficient resistance range and accuracy through selective connection and laser trimming.
Data Source
AI summary
A chip resistor includes a substrate, and a plurality of resistor elements each having a resistive film provided on the substrate and an interconnection film provided on the resistive film in contact with the resistive film. An electrode is provided on the substrate. Fuses disconnectably connect the resistor elements to the electrode. The resistive film is made of at least one material selected from the group of NiCr, NiCrAl, NiCrSi, NiCrSiAl, TaN, TaSiO2, TiN, TiNO and TiSiON.