Chip Resistor Resistance Precision via Segmented Resistive Element

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Solution Overview

Problem

Conventional chip resistors face challenges in precisely adjusting resistance values during mass production due to issues with the order of forming resistive elements and electrodes, leading to connection failures and poor connectivity, which complicates achieving a predetermined resistance value.

Innovation Solution

The chip resistor design includes a resistive element with a wide portion and narrow portions, where electrodes are positioned to overlap and contact the narrow portions, allowing for precise adjustment of the resistance value by varying the distances between the electrodes and the wide portion, and a trimming groove is used to further fine-tune the resistance value.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the resistive element and electrodes are formed in a conventional order and configuration, then the manufacturing process is simple, but the resistance value precision and connectivity are poor

Engineering Contradiction:
Improveresistance value precisionVSAvoidresistive element structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The resistive element is segmented into a wide portion and narrow portions, creating distinct functional zones. The narrow portions serve as connection regions for electrodes while the wide portion provides the main resistance path. This segmentation allows precise control of resistance values by adjusting electrode positions relative to the narrow portions, thereby improving manufacturing precision without excessive complexity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the resistive element are given different local qualities: the wide portion has larger cross-sectional area for stable resistance, while the narrow portions have smaller cross-sectional area optimized for electrode contact and connectivity. This local differentiation enables simultaneous achievement of precise resistance control and reliable connectivity.

Inventive Principle:
Principle #3Local quality

2Reliability

If electrodes are positioned to contact narrow portions of the resistive element, then connectivity and resistance precision improve, but the device structure becomes more complex

Engineering Contradiction:
ImproveconnectivityVSAvoidelectrode-resistive element configuration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The resistive element is pre-formed with narrow portions at specific locations before electrode placement. This preliminary structuring of the resistive element ensures that when electrodes are subsequently positioned, they automatically contact the optimized narrow connection regions, improving connectivity and reliability while simplifying the electrode formation process.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If a trimming groove is added to fine-tune the resistance value, then resistance precision improves, but the manufacturing process becomes more complex

Engineering Contradiction:
Improveresistance value adjustment precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

A trimming groove is extracted or removed from the resistive element material to fine-tune the resistance value. This localized removal of material allows precise adjustment of the current path length and cross-sectional area, enabling fine-tuning of resistance values without requiring complete re-manufacturing of the resistive element, thus improving precision while limiting process complexity increase.

Inventive Principle:
Principle #2Taking out (Extraction)

Data Source

PatentUS10839990B2Chip resistor manufacturing method, and chip resistor
Publication Date: 2020.11.17 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US10839990B2 patent drawing
  • US10839990B2 patent drawing
  • US10839990B2 patent drawing

AI summary

A chip resistor having a predetermined resistance value is manufactured by the following method. A resistive element is provided on an upper surface of an insulating substrate. The resistive element includes a wide portion, a first narrow portion extending from the wide portion, and a part extending from the wide portion, the first narrow portion has a smaller width than the wide portion. First and second electrodes are provided on the upper surface of the insulating substrate. The first electrode is located away from the wide portion. The first electrode contacts the first narrow portion. The first electrode overlaps the first narrow portion when viewed from above. The second electrode contacts the part of the resistive element. The second electrode overlaps the part of the resistive element when viewed from above. A distance between the narrow portion and the wide portion is determined so as to cause a resistance value between the first and second electrodes to be the predetermined resistance value. This method improves the precision of the resistance value of the chip resistor.