Chip Resistor Segmented Heat Radiator Plates Thermal Stress

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Solution Overview

Problem

Conventional chip resistors face reliability issues due to high temperature and thermal expansion differences between the resistive element and heat radiator plate, leading to potential cracking when used in high-power applications.

Innovation Solution

The chip resistor design incorporates multiple heat radiator plates made of thermally conductive ceramics or metals, spaced apart with a gap to reduce thermal stress, and a protective film with silica powder to enhance heat dissipation, while adjusting the heat conductivity of the radiator plates to manage temperature differences between electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single heat radiator plate is used, then the structure is simple, but thermal stress concentrates and causes cracking

Engineering Contradiction:

Improvestructure simplicityVSAvoidcracking resistance

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The heat radiator plate is divided into multiple segments (first heat radiator plate and second heat radiator plate) separated by a gap. This segmentation distributes the thermal stress that would otherwise concentrate in a single continuous plate, preventing cracking while maintaining structural simplicity.

Inventive Principle:

Principle #1Segmentation

2Loss of energy

If heat radiator plate covers the entire resistive element, then heat dissipation is maximized, but thermal expansion stress increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidthermal expansion stress

Core Design Contradiction:

Loss of energyVSStress or pressure

Solution Approach 1:

The heat radiator plate is segmented into multiple plates with gaps between them, allowing thermal expansion without generating excessive stress while still providing effective heat dissipation from the resistive element.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heat radiator plates are positioned to cover specific areas of the resistive element rather than the entire surface, optimizing the balance between heat dissipation efficiency and stress reduction by concentrating cooling where most needed.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively suppresses temperature rise and reduces thermal stress, enhancing the long-term reliability of the chip resistor for high-power applications by efficiently dissipating heat and minimizing the risk of cracking.

Implementation Method 1

The heat radiator plates are fastened to the second surface of the resistive element... effectively suppresses temperature rise and reduces thermal stress, enhancing the long-term reliability

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10319501B2Chip resistor

Publication Date: 2019.06.11 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD

AI summary

A chip resistor includes a resistive element, a pair of electrodes, and heat radiator plates. The resistive element is made of a plate-shaped metal. The pair of electrodes is formed on both ends of a first surface of the resistive element. The heat radiator plates are fastened to a second surface of the resistive element and are disposed spaced apart from each other via a gap therebetween.