High-Power Chip Resistor Thermal Layout for Heat Dissipation
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Solution Overview
Problem
Conventional chip resistors face challenges with high temperature buildup due to inadequate heat dissipation, which limits their power application range and can cause the protection layer to become brittle and lose its protective functions.
Innovation Solution
A high-power chip resistor design that includes a resistance layer, a first thermal conductive layer with a gap pattern, an adhesion layer, internal electrodes, a protection layer, and a second thermal conductive layer with a non-corresponding gap pattern, enhancing heat dissipation through multiple thermal conductive paths and preventing heat accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat dissipation methods (air convection and heat radiation of substrate) are used, then the structure remains simple, but the heat dissipation efficiency is insufficient leading to high temperature buildup
Solution Approach 1:
The thermal conductive layer is segmented into multiple regions including first and second thermal conductive regions with different thermal conductivities, and further divided into multiple layers (third, fourth, fifth thermal conductive layers) with varying thermal conductivity gradients. This segmentation allows optimized heat dissipation pathways while maintaining manageable structural complexity.
Solution Approach 2:
Different regions of the thermal conductive layer are assigned different thermal conductivity properties. The first thermal conductive region has higher thermal conductivity than the second thermal conductive region, creating local quality variations that optimize heat dissipation from critical areas while maintaining overall structural integrity.
2Power
If high power is applied to chip resistors, then the power application range increases, but the protection layer becomes brittle due to long-term heat absorption and loses its protective function
Solution Approach 1:
The adhesion layer serves as an intermediary between the resistance layer and the thermal conductive layer, ensuring effective thermal coupling while maintaining mechanical integrity. This intermediary structure enables high power application by efficiently transferring heat away from the protection layer, preventing brittleness and maintaining protective functions.
Solution Approach 2:
The thermal conductive layer is divided into multiple segments with different thermal conductivities arranged in specific patterns (first and second thermal conductive regions with gaps), creating multiple heat dissipation pathways that prevent heat accumulation in the protection layer, thereby maintaining its durability under high power conditions.
3Temperature
If thermal conductive layers are added to improve heat dissipation, then heat dissipation efficiency increases, but the device complexity and manufacturing steps increase
Solution Approach 1:
Multiple thermal conductive layers with different thermal conductivities are merged into a single integrated thermal management structure. The third, fourth, and fifth thermal conductive layers are combined with the adhesion layer to form a unified component that achieves superior heat dissipation while simplifying the manufacturing process compared to assembling separate components.
Solution Approach 2:
The thermal conductive layer structure serves multiple functions simultaneously: it provides thermal conduction, mechanical adhesion, and structural support. This multi-functionality reduces the need for additional separate components, thereby improving heat dissipation efficiency without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases heat dissipation efficiency, prevents the protection layer from becoming brittle, and expands the chip resistor's power withstanding range, thereby improving its reliability and performance.
Implementation Method 1
the heat generated by current flowing through the chip resistors is usually conducted through air convection and heat radiation of the substrate (for example, ceramics) itself, or the heat can be introduced into circuit boards through thermal conduction by the electrodes
Implementation Method 2
The adhesion layer is disposed between the resistance layer and the first thermal conductive layer to adhere the resistance layer and the first thermal conductive layer
Data Source
AI summary
A high-power chip resistor includes a resistance layer, a first thermal conductive layer, an adhesion layer, internal electrodes, a first protection layer and a second thermal conductive layer. The first thermal conductive layer includes first thermal conductors and a first gap between the first thermal conductors. The adhesion layer is disposed between the resistance layer and the first thermal conductive layer to adhere them. The internal electrodes are disposed on two terminals of the resistance layer. The first protection layer covers the resistance layer and portions of upper surfaces of the internal electrodes. The second thermal conductive layer is disposed on the first protection layer and includes two second thermal conductors and a second gap between the second thermal conductors. The second thermal conductors contact other portions of upper surfaces located at two terminals of the internal electrodes and not covered by the first protection layer.