Chip Resistor Layout With Thermosensitive Layer for Accurate Sensing

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Solution Overview

Problem

The accuracy of temperature measurement using metal film chip resistors is affected by environmental heat dissipation, thermal conductivity of the PCB insulating material, and the distance between the resistor and the temperature sensing element, leading to inaccuracies in temperature sensing applications.

Innovation Solution

A chip resistor design with a resistive layer and a thermosensitive layer separated by a gap, each with dedicated electrodes and protected by a protective layer, utilizing positive or negative temperature coefficient materials to enhance temperature sensing accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If temperature sensing element is integrated with metal film chip resistor, then temperature sensing function is achieved, but measurement precision deteriorates due to environmental heat dissipation and thermal conductivity effects

Engineering Contradiction:

Improvetemperature sensing functionVSAvoidtemperature measurement accuracy

Core Design Contradiction:

Adaptability or versatilityVSMeasurement precision

Solution Approach 1:

The chip resistor is divided into two separate functional portions: a first portion for resistance function with resistive layer, and a second portion for temperature sensing with thermosensitive layer. This segmentation allows each portion to be optimized independently, with the thermosensitive layer directly exposed to ambient temperature for accurate sensing while the resistive layer performs electrical resistance function.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The temperature sensing function is extracted as a separate thermosensitive layer from the traditional metal film chip resistor structure. This extracted sensing portion is positioned to be directly exposed to ambient temperature environment, separating the temperature measurement function from the resistance function to eliminate mutual interference and improve measurement accuracy.

Inventive Principle:

Principle #2Taking out (Extraction)

2Measurement precision

If separate temperature sensing element is used, then measurement precision is maintained, but device complexity increases and layout space is reduced

Engineering Contradiction:

Improvetemperature sensing accuracyVSAvoidcomponent structure

Core Design Contradiction:

Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature sensing element and chip resistor are merged into a single integrated component with shared substrate, electrodes, and protective structure. The resistive layer and thermosensitive layer are formed on the same substrate using compatible processes, creating a unified component that reduces overall device complexity while maintaining accurate temperature sensing capability.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The chip resistor structure is designed to perform multiple functions: the resistive layer provides electrical resistance for circuit operation, while the thermosensitive layer simultaneously provides temperature sensing capability. This multi-functionality eliminates the need for separate temperature sensing components, reducing layout space and simplifying the overall system design.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Measurement precision

If separate temperature sensing element and resistor are used, then measurement accuracy is maintained, but component size increases reducing layout space

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidlayout space on PCB

Core Design Contradiction:

Measurement precisionVSArea of stationary object

Solution Approach 1:

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves temperature sensing accuracy and reduces component size, increasing layout space on a printed circuit board by integrating temperature sensing functionality into the resistor.

Implementation Method 1

a material of the thermosensitive layer is a positive temperature coefficient material

Methodology Applied

Scientific EffectPositive temperature coefficient: Thermistor

Implementation Method 2

a material of the thermosensitive layer is a negative temperature coefficient material

Methodology Applied

Scientific EffectNegative temperature coefficient: Thermistor

Implementation Method 3

the heat dissipation of the environment in which the metal film chip resistor is applied

Methodology Applied

Scientific EffectHeat dissipation: Convection

Implementation Method 4

the thermal conductivity of the insulating material used for the PCB

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260066158A1Chip resistor with temperature sensing function and manufacturing method thereof

Publication Date: 2026.03.05 YAGEO CORP

AI summary

A chip resistor with a temperature sensing function is provided. The chip resistor includes a substrate, a resistive layer, a thermosensitive layer, a pair of first electrodes, and a pair of second electrodes. The resistive layer is disposed on a first portion of the substrate. The thermosensitive layer is disposed on a second portion of the substrate, in which a gap is between the resistive layer and the thermosensitive layer. The pair of first electrodes respectively cover two sides of the resistive layer. The pair of second electrodes respectively cover two sides of the thermosensitive layer.