Chip Resistor Coating Layout for Precise Trimming and Dicing
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Solution Overview
Problem
The miniaturization of chip resistors complicates precise laser scribing of secondary division prediction lines, making it difficult to manufacture chip resistors with simple and efficient processes.
Innovation Solution
The method involves forming resistive elements in a belt shape between secondary division prediction lines, with electrodes extending across primary lines, and using a glass coat layer to expose resistive elements for laser trimming, eliminating the need for complex laser scribing and ensuring uniform film thickness. Additionally, a transparent resin coat layer allows for visual verification during dicing, preventing errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser scribing is used to divide front electrodes along secondary division prediction lines before resistance adjustment, then the manufacturing process can proceed with electrode separation, but the process becomes complicated and precise positioning becomes difficult with miniaturization
Solution Approach 1:
The glass coat layer is formed in advance to extend across secondary division prediction lines, exposing resistive elements before the resistance adjustment step. This preliminary action eliminates the need for complex laser scribing to divide electrodes, as the glass coat layer naturally exposes the resistive elements at the required positions for subsequent laser trimming.
Solution Approach 2:
The function of exposing resistive elements for laser trimming is extracted from the electrode division process. Instead of using laser scribing to both divide electrodes and expose resistive elements, the glass coat layer is specifically designed to extend across secondary division lines to expose resistive elements, separating this function from the electrode division function.
2Length of moving object
If chip resistor size is reduced for miniaturization, then smaller components are achieved, but precise laser scribing of secondary division prediction lines becomes difficult
Solution Approach 1:
The glass coat layer serves as an intermediary structure that extends across secondary division prediction lines to expose resistive elements. This intermediary approach eliminates the need for direct laser scribing of secondary division lines, as the glass coat layer's extension provides the necessary exposure without requiring precise laser positioning at the miniaturized scale.
3Reliability
If transparent resin coat layer is added for visual verification during dicing, then dicing errors are prevented, but the manufacturing process includes an additional coating step
Solution Approach 1:
A transparent resin coat layer is applied over the glass coat layer and chip base body. The transparency of this layer allows visual verification of the resistive element positions and dicing progress during the dicing process, enabling detection and prevention of dicing errors while maintaining a relatively simple additional coating step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, ensures precise resistance value adjustment, and maintains uniform film thickness, enabling reliable connection of end face electrodes even with miniaturization, while preventing dicing errors through visual verification.
Implementation Method 1
a probe is abutted onto a pair of front electrodes connected to both ends of the resistive element to emit a laser beam from the top of the glass coat layer for forming a trimming groove on the resistive element
Implementation Method 2
the large substrate is cut along the primary division prediction lines and the secondary division prediction lines by dicing blades, so that individual chip base bodies having the same outer shape as the chip resistor are formed
Data Source
AI summary
Resistive elements are formed in belt shape in regions sandwiched between secondary division prediction lines set onto a large substrate and extending in a direction orthogonal to primary division prediction lines, a plurality of front electrodes disposed facing each other at predetermined intervals on the resistive elements are formed so as to be across the primary division prediction lines, a glass coat layer covering each of the resistive elements and extending in the direction orthogonal to the secondary division prediction lines is formed, a resin coat layer covering an entire surface of the large substrate from a top of the glass coat layer is formed, and after that, the large substrate is diced along the primary division prediction lines and the secondary division prediction lines to obtain individual chip base bodies.