High-Frequency Amplifier Structure With Resonator Above Chip

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Solution Overview

Problem

High frequency devices experience oscillation due to leakage of amplified signals, which can be exacerbated by the reflection of signals from reference potential layers, leading to unstable amplifier operation.

Innovation Solution

Incorporating a resonator between the semiconductor chip and the reference potential layer, designed to resonate at the operating frequency of the amplifier, minimizes impedance and absorbs or reflects leaked signals, thereby suppressing oscillation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a reference potential layer is provided above the semiconductor chip to provide a reference potential, then the amplifier can operate with a stable reference potential, but high frequency signals may leak and reflect from the reference potential layer causing oscillation

Engineering Contradiction:
Improveamplifier operation stabilityVSAvoidsignal oscillation
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A resonator is introduced as an intermediary component between the semiconductor chip and the first reference potential layer. The resonator has minimal impedance at the resonance frequency, allowing it to absorb or reflect leaked high frequency signals before they can reflect from the reference potential layer and cause oscillation. This mediator prevents the harmful interaction between the amplifier signals and the reference potential layer.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The resonator is designed to have minimal impedance at the specific resonance frequency that matches the amplifier's operating frequency. By converting the leaked high frequency signals (which would normally cause harmful oscillation) into resonant energy that is absorbed or constructively reflected by the resonator, the harmful effect is transformed into a beneficial signal absorption mechanism that stabilizes amplifier operation.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

2Reliability

If the resonator is designed with minimal impedance at the resonance frequency to absorb leaked signals, then oscillation is suppressed, but the device structure becomes more complex

Engineering Contradiction:
Improveoscillation suppressionVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The resonator structure serves multiple functions simultaneously: it provides a reference potential path, absorbs leaked high frequency signals through its minimal impedance at resonance frequency, and stabilizes amplifier operation. By combining these functions into a single component, the overall device complexity is minimized while achieving reliable oscillation suppression.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The resonator effectively attenuates or reflects high frequency signals that would otherwise cause oscillation, stabilizing the amplifier operation and maintaining consistent performance regardless of installation environment.

Implementation Method 1

a resonator provided between the semiconductor chip and the first reference potential layer in the upper direction perpendicular to the front surface of the semiconductor substrate, wherein a resonance frequency of the resonator is included in an operating frequency band of the amplifier, and an impedance of the resonator becomes minimal at the resonance frequency

Methodology Applied
Scientific EffectResonance: Resonance

Data Source

PatentUS12354979B2High frequency device
Publication Date: 2025.07.08 SUMITOMO ELECTRIC INDUSTRIES LTD
  • US12354979B2 patent drawing
  • US12354979B2 patent drawing
  • US12354979B2 patent drawing

AI summary

A high frequency device includes a semiconductor chip including a semiconductor substrate, and an amplifier provided on a front surface of the semiconductor substrate and amplifying a high frequency signal, a first reference potential layer provided above the semiconductor chip in an upper direction perpendicular to the front surface of the semiconductor substrate, and provided so as to overlap with the semiconductor chip in a plan view from above, and to which a reference potential is supplied, and a resonator provided between the semiconductor chip and the first reference potential layer in the upper direction perpendicular to the front surface of the semiconductor substrate, wherein a resonance frequency of the resonator is included in an operating frequency band of the amplifier, and an impedance of the resonator becomes minimal at the resonance frequency.