Chip Scale Infrared Sensor Without Vacuum Packaging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing infrared (IR) sensors require vacuum packaging to achieve sensitivity, which is not feasible for combining near IR (NIR) and middle IR (MIR) functions in a single device.
Innovation Solution
A non-vacuum packaged chip scale package sensor that includes a substrate with a sensing element configured to change resistance with temperature and an absorbing layer for MIR radiation, allowing simultaneous detection of NIR and MIR without the need for vacuum packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If vacuum packaging is used to achieve sensor sensitivity, then measurement precision is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent extracts the vacuum packaging requirement from the sensor system, achieving sensor sensitivity without needing a vacuum environment. This is accomplished by using a bolometer sensing element that can detect thermal radiation directly in a non-vacuum packaged chip scale format, eliminating the need for complex vacuum sealing mechanisms while maintaining measurement precision.
Solution Approach 2:
The patent creates a multi-functional sensor that can detect both near-infrared and middle-infrared radiation using a single bolometer element. This universal sensing capability eliminates the need for separate sensors and vacuum packaging for each function, reducing device complexity while maintaining sensitivity across multiple wavelength ranges.
2Adaptability or versatility
If separate NIR and MIR sensors are used to achieve functional versatility, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent merges near-infrared and middle-infrared detection capabilities into a single sensor device. The bolometer element is designed to detect thermal radiation across both wavelength ranges, and the optical filter selectively transmits specific wavelength bands to enable simultaneous NIR and MIR detection with one sensor, eliminating the need for multiple separate sensors.
Solution Approach 2:
The sensor is designed with universal functionality to detect both NIR and MIR radiation. The bolometer element serves multiple detection functions, and when combined with an optical filter, achieves spectral selectivity while maintaining the ability to detect both wavelength ranges, providing adaptability without increasing device complexity.
3Reliability
If vacuum packaging is implemented to protect sensor elements, then reliability is improved, but ease of manufacture deteriorates
Solution Approach 1:
The patent removes the vacuum packaging step from the manufacturing process while maintaining sensor element protection. The chip scale package design provides sufficient protection for the bolometer element without requiring vacuum sealing, significantly simplifying manufacturing while maintaining reliability through alternative protective structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the detection of both NIR and MIR radiation without vacuum packaging, improving sensor functionality and reducing manufacturing complexity while maintaining sensitivity.
Implementation Method 1
an absorbing layer configured to absorb middle infrared ('MIR') radiation
Implementation Method 2
The sensing element is configured to change resistance with temperature
Implementation Method 3
a plurality of photo-current terminals configured to measure a current induced by near infrared ('NIR') radiation
Data Source
AI summary
Described herein is a sensor in chip scale package form factor. For example, a non-vacuum packaged sensor chip described herein includes a substrate, and a sensing element arranged on the substrate. The sensing element is configured to change resistance with temperature. Additionally, the non-vacuum packaged sensor chip includes an absorbing layer configured to absorb middle infrared (“MIR”) radiation.