Chip-Scale LED Lens Molding for Uniform Light Distribution
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Solution Overview
Problem
Conventional lens-integrated light-emitting diode packages face challenges in manufacturing complexity, high costs, and difficulty in maintaining uniform light directing characteristics, especially in forming small-sized lenses with micro-unit dimensions, while chip scale packages struggle to create lenses that can alter light directing characteristics.
Innovation Solution
A chip scale light-emitting diode package manufacturing method involving the creation of a lens molding sheet with intaglios, forming a lens layer, applying an adhesive layer, arranging light-emitting diode chips, and forming a molding part to cover the chips, resulting in a package with exposed electrode pads and a precisely shaped lens matching the chip's center, allowing for controlled light distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dam structure is provided to keep the thickness of the lens constant, then the lens thickness uniformity is improved, but the package size increases significantly (diameter must be four times the height)
Solution Approach 1:
The patent applies preliminary action by pre-forming the lens shape directly during the molding process using a mold with a predetermined lens shape. The mold includes a lens forming portion that defines the final lens geometry, allowing the lens to be formed with uniform thickness without requiring additional dam structures. This eliminates the need for post-molding thickness control mechanisms while maintaining compact package dimensions.
2Strength
If the bottom area of the lens is increased to implement a dome-shaped lens over a certain thickness, then the lens structural integrity is improved, but the package becomes larger than necessary
Solution Approach 1:
The patent utilizes spheroidality by forming the lens with a predetermined curved shape that optimizes structural integrity while minimizing footprint. The mold includes a lens forming portion that creates a dome-shaped lens with optimized curvature, allowing the lens to achieve necessary mechanical strength without requiring excessive bottom area. This curved geometry distributes stresses efficiently while maintaining compact package dimensions.
3Reliability
If conventional lens-integrated package structure is used, then light directing characteristic can be achieved, but the manufacturing process is complicated and cost is high
Solution Approach 1:
The patent applies merging by integrating the lens formation process directly into the molding step. The mold includes both a cavity for forming the package body and a lens forming portion for creating the lens, allowing both components to be manufactured in a single operation. This eliminates separate lens formation and assembly steps, simplifying the manufacturing process while maintaining precise lens geometry for optimal light directing characteristics.
4Area of stationary object
If chip scale package structure is used to reduce size, then package size is minimized, but it is difficult to form a lens capable of changing light directing characteristic
Solution Approach 1:
The patent applies local quality by forming a lens with specific optical properties in a localized region of the chip scale package. The mold includes a lens forming portion that creates a lens with predetermined shape and optical characteristics on the upper surface of the package body. This localized lens formation maintains the compact chip scale dimensions while providing tailored light directing characteristics through the specially shaped lens region.
Data Source
AI summary
A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.