Chip-Scale LED Lens Packaging for Uniform Light Distribution
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Solution Overview
Problem
Conventional lens-integrated light-emitting diode packages face challenges in manufacturing complexity, high costs, and difficulty in maintaining uniform light directing characteristics, especially in forming small-sized lenses with micro units, while chip scale packages struggle to create lenses that can alter light directing characteristics.
Innovation Solution
A chip scale light-emitting diode package manufacturing method involving the creation of a lens molding sheet with intaglios, forming a lens layer, and using an adhesive layer to align light-emitting diode chips with exposed electrode pads, followed by forming a molding part to cover the chips, allowing for precise lens formation and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a lens is formed by dispensing light-transmitting resin in a central area of the package body, then the lens can be formed with a dome shape, but the manufacturing process becomes complicated and the manufacturing cost increases
Solution Approach 1:
The patent applies preliminary action by pre-forming a lens molding sheet with intaglio patterns before assembly. The intaglios are created in advance on the molding sheet, which is then transferred to the package body during assembly. This eliminates the need for complex resin dispensing processes and dam structures, simplifying the manufacturing process while maintaining precise lens shape control
Solution Approach 2:
The patent uses copying by transferring the lens pattern from the molding sheet to the package body. The intaglio patterns on the molding sheet serve as a template that is replicated onto the final lens structure through the assembly process. This copying approach enables precise lens formation without requiring complex direct manufacturing processes
2Manufacturing precision
If a dam structure is provided on the upper surface of the package body to limit resin spread, then the lens thickness can be maintained constant, but the package diameter must be four times the lens height, making the package larger than necessary
Solution Approach 1:
The patent extracts the dam structure from the package body design and relocates it to the molding sheet. By removing the need for dams on the package body, the patent eliminates the constraint that forced the package diameter to be four times the lens height. The molding sheet with pre-formed intaglios provides the necessary structural control without occupying additional package space
Solution Approach 2:
The patent moves the lens formation constraint from the horizontal plane (dam structures on package body surface) to the vertical dimension (intaglio depth on molding sheet). This dimensional shift allows precise lens thickness control through the depth of intaglios rather than through horizontal dam structures, enabling compact package design
3Area of stationary object
If the package size is reduced to micrometer unit size as in chip scale packages, then the package becomes much smaller, but it becomes difficult to form a lens capable of changing light directing characteristic
Solution Approach 1:
The patent applies local quality by concentrating the lens-forming functionality in a localized molding sheet with precise intaglio patterns. The intaglios are formed only in the specific areas where lens functionality is needed, allowing micrometer-scale packages to incorporate precise optical elements without requiring the entire package to be enlarged. This localized approach enables light directing control in compact form factors
Solution Approach 2:
The patent uses preliminary action by pre-forming the lens patterns on the molding sheet before final assembly. This allows precise lens geometries to be prepared in advance at micro-scale, enabling the integration of light-directing lenses into chip-scale packages without compromising optical functionality
Data Source
AI summary
A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.