Chip-Scale LED Package with Exposed Electrodes and Refractive Particles
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Solution Overview
Problem
Conventional LED package structures face reliability and defect issues due to the die-bonding and wire-bonding processes, and they are not optimized for size reduction.
Innovation Solution
A chip-scale LED package structure is developed, featuring a white light emitting unit, red flip-chip LED, green flip-chip LED, and blue flip-chip LED encapsulated in a layer with refractive particles, with exposed electrodes to improve reliability and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If die-bonding and wire-bonding processes are used in conventional LED package structures, then electrical connections can be established, but reliability issues and defects occur
Solution Approach 1:
The patent removes the die-bonding and wire-bonding processes from the LED package structure. The LED chip is directly mounted on the substrate without requiring separate bonding steps, extracting the problematic bonding operations that caused reliability issues and defects.
Solution Approach 2:
The patent combines the LED chip mounting and electrical connection functions into a single integrated structure. The electrode directly contacts the substrate contact pad, merging what were previously separate bonding operations into one reliable connection interface.
2Volume of moving object
If conventional LED package structures are used, then lighting function is achieved, but package size cannot be reduced
Solution Approach 1:
The patent transitions from a planar package layout to a three-dimensional vertical stacking architecture. The LED chip, reflective layer, and substrate are arranged in vertical layers, enabling compact packaging while maintaining manufacturing simplicity through standardized layer fabrication processes.
3Illumination intensity
If multiple light-emitting chips are mounted on substrate, then white light emission is achieved, but reliability and defect issues result from bonding processes
Solution Approach 1:
The patent uses a composite structure combining the LED chip semiconductor material with a reflective layer material on the substrate. This composite arrangement enables efficient light extraction and white light emission while eliminating the need for unreliable bonding processes between separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively addresses reliability and defect issues associated with conventional LED package structures by encapsulating LEDs and exposing their electrodes, enhancing lighting performance and reducing package size.
Implementation Method 1
The encapsulation layer includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin
Data Source
AI summary
A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.